Invention Grant
- Patent Title: Manufacturing method of a hollow shielding structure for circuit elements
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Application No.: US15386823Application Date: 2016-12-21
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Publication No.: US10426067B2Publication Date: 2019-09-24
- Inventor: Keon Kuk , Il-ju Mun , Ji-woon Yeom , Yeon-kyoung Jung , Kyong-il Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: KR10-2016-0108435 20160825
- Main IPC: H05K3/36
- IPC: H05K3/36 ; H05K9/00 ; H05K3/30 ; H05K1/02

Abstract:
A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.
Public/Granted literature
- US10477737B2 Manufacturing method of a hollow shielding structure for circuit elements Public/Granted day:2019-11-12
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