公开(公告)号：US10201072B2

公开(公告)日：2019-02-05

申请号：US15489190

申请日：2017-04-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Keon Kuk ,  Il-ju Mun ,  Jin-woo Jung ,  Ji-woon Yeom

IPC: H05K1/18 ,  H05K1/02 ,  B05B1/00 ,  H05K3/28 ,  H05K9/00

Abstract: An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a printed circuit board (PCB), a plurality of elements mounted on a region of the PCB, an insulating dam provided on a peripheral portion of the region of the PCB and covering a portion of the plurality of elements; an insulating member provided on a remaining portion of the region the PCB that is surrounded by the insulating dam and covering a remaining portion of the plurality of elements; and a shielding layer covering outer surfaces of the insulating dam and the insulating member.

公开(公告)号：US10292318B2

公开(公告)日：2019-05-14

申请号：US15386823

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon Kuk ,  Il-ju Mun ,  Ji-woon Yeom ,  Yeon-kyoung Jung ,  Kyong-il Kim

IPC: H05K3/36 ,  H05K9/00 ,  H05K3/30 ,  H05K1/02

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

公开(公告)号：US10231368B2

公开(公告)日：2019-03-12

申请号：US15386823

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon Kuk ,  Il-ju Mun ,  Ji-woon Yeom ,  Yeon-kyoung Jung ,  Kyong-il Kim

IPC: H05K3/36 ,  H05K9/00 ,  H05K3/30 ,  H05K1/02

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

公开(公告)号：US11119571B2

公开(公告)日：2021-09-14

申请号：US16637604

申请日：2018-07-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chi-yul Yoon ,  Jae-woo Ko ,  Ji-woon Yeom ,  Kyu-sub Kwak ,  Jae-Eun Kang

IPC: G06F3/00 ,  G06F3/01 ,  G02B27/01 ,  G06T19/00

Abstract: Provided is a virtual image display device including: an image generator outputting a virtual image; a filter transmitting light in a first polarization state in the output virtual image; a multipath optical element guiding the transmitted light in the first polarization state; a first optical element arranged on a first side of the multipath optical element and allowing the guided light in the first polarization state and real-world light to pass therethrough; a second optical element arranged on a second side opposite to the first side of the multipath optical element and allowing the real-world light to pass therethrough; and a processor controlling the image generator, the first optical element, and the second optical element.

公开(公告)号：US10356965B2

公开(公告)日：2019-07-16

申请号：US15386823

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon Kuk ,  Il-ju Mun ,  Ji-woon Yeom ,  Yeon-kyoung Jung ,  Kyong-il Kim

IPC: H05K3/36 ,  H05K9/00 ,  H05K3/30 ,  H05K1/02

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

公开(公告)号：US10477737B2

公开(公告)日：2019-11-12

申请号：US15386823

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon Kuk ,  Il-ju Mun ,  Ji-woon Yeom ,  Yeon-kyoung Jung ,  Kyong-il Kim

IPC: H05K3/36 ,  H05K9/00 ,  H05K3/30 ,  H05K1/02

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

公开(公告)号：US10477687B2

公开(公告)日：2019-11-12

申请号：US15488024

申请日：2017-04-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Il-ju Mun ,  Keon Kuk ,  Ji-woon Yeom

IPC: H05K1/00 ,  H05K1/18 ,  H01L23/552 ,  H05K9/00 ,  H05K1/02 ,  B05D1/26 ,  B05D7/00

Abstract: An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a shielding dam provided on a printed circuit board, the shielding dam forming a closed loop that defines a periphery of adjacent shielding regions of the printed circuit board; an insulating member that is provided on the adjacent shielding regions within the shielding dam, the insulating member covering circuit devices provided in the adjacent shielding regions; and a shielding member that covers an upper surface of the insulating member, wherein the shielding dam includes a border portion surrounding the adjacent shielding regions, and a partition portion disposed between the adjacent shielding regions and within the border portion.

公开(公告)号：US10306816B2

公开(公告)日：2019-05-28

申请号：US15789184

申请日：2017-10-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Il-ju Mun ,  Keon Kuk ,  Ji-woon Yeom

IPC: H05K7/10 ,  H05K7/12 ,  H05K9/00 ,  H05K1/11 ,  H05K1/18 ,  H01L23/552 ,  H05K3/40 ,  H05K3/28 ,  H05K3/32

Abstract: An EMI shielding structure includes a shielding pad surrounding at least one circuit component mounted on a printed circuit board and grounded to a ground pad disposed on the printed circuit board; and a shield can configured to cover the at least one circuit component, wherein a portion of the shield can is attached to the shielding pad.

公开(公告)号：US11445645B2

公开(公告)日：2022-09-13

申请号：US16262080

申请日：2019-01-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon Kuk ,  Il-ju Mun ,  Ji-woon Yeom ,  Yeon-kyoung Jung ,  Kyong-il Kim

IPC: H05K9/00 ,  H05K3/30 ,  H05K1/02

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

公开(公告)号：US10426067B2

公开(公告)日：2019-09-24

申请号：US15386823

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon Kuk ,  Il-ju Mun ,  Ji-woon Yeom ,  Yeon-kyoung Jung ,  Kyong-il Kim

IPC: H05K3/36 ,  H05K9/00 ,  H05K3/30 ,  H05K1/02

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.