公开(公告)号：US10356965B2

公开(公告)日：2019-07-16

申请号：US15386823

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon Kuk ,  Il-ju Mun ,  Ji-woon Yeom ,  Yeon-kyoung Jung ,  Kyong-il Kim

IPC: H05K3/36 ,  H05K9/00 ,  H05K3/30 ,  H05K1/02

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

公开(公告)号：US10292318B2

公开(公告)日：2019-05-14

申请号：US15386823

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon Kuk ,  Il-ju Mun ,  Ji-woon Yeom ,  Yeon-kyoung Jung ,  Kyong-il Kim

IPC: H05K3/36 ,  H05K9/00 ,  H05K3/30 ,  H05K1/02

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

公开(公告)号：US10231368B2

公开(公告)日：2019-03-12

申请号：US15386823

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon Kuk ,  Il-ju Mun ,  Ji-woon Yeom ,  Yeon-kyoung Jung ,  Kyong-il Kim

IPC: H05K3/36 ,  H05K9/00 ,  H05K3/30 ,  H05K1/02

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

公开(公告)号：US10477737B2

公开(公告)日：2019-11-12

申请号：US15386823

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon Kuk ,  Il-ju Mun ,  Ji-woon Yeom ,  Yeon-kyoung Jung ,  Kyong-il Kim

IPC: H05K3/36 ,  H05K9/00 ,  H05K3/30 ,  H05K1/02

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

公开(公告)号：US10477687B2

公开(公告)日：2019-11-12

申请号：US15488024

申请日：2017-04-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Il-ju Mun ,  Keon Kuk ,  Ji-woon Yeom

IPC: H05K1/00 ,  H05K1/18 ,  H01L23/552 ,  H05K9/00 ,  H05K1/02 ,  B05D1/26 ,  B05D7/00

Abstract: An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a shielding dam provided on a printed circuit board, the shielding dam forming a closed loop that defines a periphery of adjacent shielding regions of the printed circuit board; an insulating member that is provided on the adjacent shielding regions within the shielding dam, the insulating member covering circuit devices provided in the adjacent shielding regions; and a shielding member that covers an upper surface of the insulating member, wherein the shielding dam includes a border portion surrounding the adjacent shielding regions, and a partition portion disposed between the adjacent shielding regions and within the border portion.

公开(公告)号：US10306816B2

公开(公告)日：2019-05-28

申请号：US15789184

申请日：2017-10-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Il-ju Mun ,  Keon Kuk ,  Ji-woon Yeom

IPC: H05K7/10 ,  H05K7/12 ,  H05K9/00 ,  H05K1/11 ,  H05K1/18 ,  H01L23/552 ,  H05K3/40 ,  H05K3/28 ,  H05K3/32

Abstract: An EMI shielding structure includes a shielding pad surrounding at least one circuit component mounted on a printed circuit board and grounded to a ground pad disposed on the printed circuit board; and a shield can configured to cover the at least one circuit component, wherein a portion of the shield can is attached to the shielding pad.

公开(公告)号：US10566293B2

公开(公告)日：2020-02-18

申请号：US15061233

申请日：2016-03-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Keon Kuk ,  Young-dae Ko ,  O-hyun Beak ,  Eun-bong Han ,  Hyeon-hyang Kim ,  Yeon-kyoung Jung ,  Il-ju Mun

IPC: H01L23/552 ,  B05B15/20 ,  H05K3/28 ,  H01L23/24 ,  H05K1/02 ,  H01L23/498 ,  H01L23/00

Abstract: A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.

公开(公告)号：US10201072B2

公开(公告)日：2019-02-05

申请号：US15489190

申请日：2017-04-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Keon Kuk ,  Il-ju Mun ,  Jin-woo Jung ,  Ji-woon Yeom

IPC: H05K1/18 ,  H05K1/02 ,  B05B1/00 ,  H05K3/28 ,  H05K9/00

Abstract: An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a printed circuit board (PCB), a plurality of elements mounted on a region of the PCB, an insulating dam provided on a peripheral portion of the region of the PCB and covering a portion of the plurality of elements; an insulating member provided on a remaining portion of the region the PCB that is surrounded by the insulating dam and covering a remaining portion of the plurality of elements; and a shielding layer covering outer surfaces of the insulating dam and the insulating member.

公开(公告)号：US11445645B2

公开(公告)日：2022-09-13

申请号：US16262080

申请日：2019-01-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon Kuk ,  Il-ju Mun ,  Ji-woon Yeom ,  Yeon-kyoung Jung ,  Kyong-il Kim

IPC: H05K9/00 ,  H05K3/30 ,  H05K1/02

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

公开(公告)号：US10531599B2

公开(公告)日：2020-01-07

申请号：US16124836

申请日：2018-09-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Il-ju Mun ,  Keon Kuk ,  Kyong-il Kim ,  Jin-woo Jung

IPC: H05K9/00 ,  H05K1/18 ,  H05K7/20

Abstract: An electromagnetic interference shielding structure is provided. The electromagnetic interference shielding structure includes a shield pad and a shield can. The shield pad is configured to surround at least one circuit element mounted on a printed circuit board, and to be grounded to a ground pad formed on a printed circuit board. The shield can include an upper plate, and a sidewall extending from the upper plate and partly embedded in the shield pad.