公开(公告)号：US10477737B2

公开(公告)日：2019-11-12

申请号：US15386823

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon Kuk ,  Il-ju Mun ,  Ji-woon Yeom ,  Yeon-kyoung Jung ,  Kyong-il Kim

IPC: H05K3/36 ,  H05K9/00 ,  H05K3/30 ,  H05K1/02

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

公开(公告)号：US10477687B2

公开(公告)日：2019-11-12

申请号：US15488024

申请日：2017-04-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Il-ju Mun ,  Keon Kuk ,  Ji-woon Yeom

IPC: H05K1/00 ,  H05K1/18 ,  H01L23/552 ,  H05K9/00 ,  H05K1/02 ,  B05D1/26 ,  B05D7/00

Abstract: An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a shielding dam provided on a printed circuit board, the shielding dam forming a closed loop that defines a periphery of adjacent shielding regions of the printed circuit board; an insulating member that is provided on the adjacent shielding regions within the shielding dam, the insulating member covering circuit devices provided in the adjacent shielding regions; and a shielding member that covers an upper surface of the insulating member, wherein the shielding dam includes a border portion surrounding the adjacent shielding regions, and a partition portion disposed between the adjacent shielding regions and within the border portion.

公开(公告)号：US10306816B2

公开(公告)日：2019-05-28

申请号：US15789184

申请日：2017-10-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Il-ju Mun ,  Keon Kuk ,  Ji-woon Yeom

IPC: H05K7/10 ,  H05K7/12 ,  H05K9/00 ,  H05K1/11 ,  H05K1/18 ,  H01L23/552 ,  H05K3/40 ,  H05K3/28 ,  H05K3/32

Abstract: An EMI shielding structure includes a shielding pad surrounding at least one circuit component mounted on a printed circuit board and grounded to a ground pad disposed on the printed circuit board; and a shield can configured to cover the at least one circuit component, wherein a portion of the shield can is attached to the shielding pad.

公开(公告)号：US10139139B2

公开(公告)日：2018-11-27

申请号：US15511851

申请日：2015-05-21

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION

Inventor： Hee Moon Jeong ,  Seong Ho Kil ,  Seok Uk Kim ,  Keon Kuk ,  Yong Chan Kim ,  Jae Jun Lee ,  Yong Seok Jeon

IPC: F25B29/00 ,  F25B49/02 ,  F25D17/02 ,  F25B40/04 ,  F25B9/08 ,  F25D11/00 ,  F25D17/04 ,  F25B5/02 ,  F25B5/04 ,  F25B40/06 ,  F24F5/00 ,  F25B13/00 ,  F25B40/00

Abstract: Disclosed herein is a refrigeration cycle includes a first refrigerant circuit configured to cause a refrigerant ejected from a compressor to flow through a condenser, an ejector, a first evaporator, and a second evaporator and flow back to the compressor; a second refrigerant circuit configured to cause the refrigerant to bypass the first evaporator in the first refrigerant circuit; and a third refrigerant circuit branching at a junction provided at a downstream end of the condenser from at least one of the first refrigerant circuit and the second refrigerant circuit, and configured to cause the refrigerant to flow through an expansion device and a third evaporator and flow to the ejector. By such configuration, a coefficient of performance (COP) of a refrigeration cycle may be improved and an ejector may be used to improve energy efficiency.

公开(公告)号：US20140064764A1

公开(公告)日：2014-03-06

申请号：US14073329

申请日：2013-11-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dae-hwan Kim ,  Keon Kuk ,  Jin-han Kim ,  Jun-o Kim ,  Tatsuhiro Otsuka ,  Young-dae Ko

IPC: G03G15/20

CPC classification number: G03G15/2039 ,  G03G15/2042

Abstract: The apparatus includes a heating roller that generates heat for melting toner attached to a printing medium; a first induction coil that is disposed outside the heating roller and heats the heating roller by using induced current generated according to current flowing through the first induction coil; two second induction coils that are disposed at upper portions of both ends of the first induction coil and heat the heating roller by using induced current generated according to current flowing through the two second induction coils; a power supply unit that supplies current to the first induction coil and the two second induction coils; and a control unit that controls the power supply unit to supply current flowing in the same direction or different directions to the first induction coil and the second induction coils according to the size of paper fed into the heating roller.

Abstract translation: 该装置包括加热辊，该加热辊产生用于熔化附着在打印介质上的调色剂的热量; 第一感应线圈，其设置在所述加热辊的外侧，并使用根据流过所述第一感应线圈的电流产生的感应电流加热所述加热辊; 两个第二感应线圈，其设置在第一感应线圈的两端的上部，并且通过使用根据流经两个第二感应线圈的电流产生的感应电流加热加热辊; 电源单元，其向所述第一感应线圈和所述两个第二感应线圈提供电流; 以及控制单元，其控制所述电源单元根据供给到所述加热辊中的纸张的尺寸，向与所述第一感应线圈和所述第二感应线圈相同的方向或不同方向供给电流。

公开(公告)号：US10913201B2

公开(公告)日：2021-02-09

申请号：US15229981

申请日：2016-08-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon Kuk ,  Eun-bong Han ,  Young-dae Ko ,  Hyeon-hyang Kim ,  O-hyun Beak ,  Jun-hee Lee ,  Yeon-kyoung Jung

IPC: B29C67/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/00 ,  B29C64/112 ,  B33Y50/02

Abstract: An object forming apparatus and a controlling method thereof are provided. The object forming apparatus includes an injector configured to inject an object forming material based on object data, a base part in which an object is formed through stacking of the injected object forming material, a sensor configured to detect a height of the object stacked on the base part, and a controller configured to control the injector based on a signal output from the sensor.

公开(公告)号：US10594020B2

公开(公告)日：2020-03-17

申请号：US16020386

申请日：2018-06-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-hoon Min ,  Keon Kuk ,  In-hak Na

IPC: H01Q1/38 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q21/08 ,  H01Q9/04 ,  H01Q23/00 ,  H01Q3/40 ,  H01Q13/02 ,  H01Q21/00 ,  H01Q13/10 ,  H01Q9/06 ,  H01Q9/28

Abstract: An electronic device having an antenna element is provided. The electronic device includes a printed circuit board on which a plurality of components are mounted, at least one antenna element mounted on the printed circuit board, an insulating dam formed on the printed circuit board and configured to surround the at least one antenna element, and a dielectric part configured to fill an inside of the insulating dam and to support the at least one antenna element.

公开(公告)号：US10292318B2

公开(公告)日：2019-05-14

申请号：US15386823

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon Kuk ,  Il-ju Mun ,  Ji-woon Yeom ,  Yeon-kyoung Jung ,  Kyong-il Kim

IPC: H05K3/36 ,  H05K9/00 ,  H05K3/30 ,  H05K1/02

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

公开(公告)号：US10231368B2

公开(公告)日：2019-03-12

申请号：US15386823

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon Kuk ,  Il-ju Mun ,  Ji-woon Yeom ,  Yeon-kyoung Jung ,  Kyong-il Kim

IPC: H05K3/36 ,  H05K9/00 ,  H05K3/30 ,  H05K1/02

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

公开(公告)号：US09434838B2

公开(公告)日：2016-09-06

申请号：US14502072

申请日：2014-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yeon Kyoung Jung ,  O Hyun Beak ,  Keon Kuk ,  Eun Bong Han ,  Yong Hyun Lim ,  Jong Youb Ryu

IPC: G03G9/097 ,  B29C71/04 ,  C08F2/46 ,  C08G61/04 ,  C08L33/08 ,  B05C5/00 ,  B33Y30/00 ,  B05D5/00 ,  C09D11/101 ,  C09D11/38 ,  C09D11/40 ,  C09D11/54

CPC classification number: C08L33/08 ,  B05C5/00 ,  B05D5/00 ,  B33Y30/00 ,  C08L2205/025 ,  C09D11/101 ,  C09D11/38 ,  C09D11/40 ,  C09D11/54

Abstract: A multi-color ink for 3D printing, a 3D printer, and a method of controlling the 3D printer are provided. The multi-color ink for 3D printing including a first ink composition that includes a photocurable material, a photoinitiator configured to cure the photocurable material, a first colorant, and an anti-intercolor bleed agent configured to prevent intercolor bleeding occurring when the plurality of ink compositions come into contact with each other, and a second ink composition that includes a photocurable material, a photoinitiator configured to cure the photocurable material, and a second colorant having an acid moiety involved in a reaction with the anti-intercolor bleed agent to cause aggregation. The multi-color ink for 3D printing may enable a clear image by inhibiting intercolor bleeding that occurs when ink compositions with different colors are printed to be adjacent to each other before curing during 3D printing.

Abstract translation: 提供了用于3D打印的多色油墨，3D打印机以及3D打印机的控制方法。 用于3D打印的多色油墨，包括包含可光固化材料的第一油墨组合物，被配置成固化可光固化材料的光引发剂，第一着色剂和抗间色渗色剂，其被配置为防止当多个油墨 组合物彼此接触，并且包括光固化材料的第二油墨组合物，被配置成固化可光固化材料的光引发剂和具有与抗间色渗色剂反应的酸部分引起聚集的第二着色剂 。 用于3D印刷的多色油墨可以通过抑制在3D打印期间固化之前印刷具有不同颜色的油墨组合物彼此相邻而发生的色间渗色来实现清晰的图像。