Invention Grant
- Patent Title: Flux applying apparatus
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Application No.: US15620031Application Date: 2017-06-12
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Publication No.: US10434592B2Publication Date: 2019-10-08
- Inventor: Hisaki Hayashi
- Applicant: Fujitsu Ten Limited
- Applicant Address: JP Kobe-Shi
- Assignee: FUJITSU TEN LIMITED
- Current Assignee: FUJITSU TEN LIMITED
- Current Assignee Address: JP Kobe-Shi
- Agency: Seed Intellectual Property Law Group LLP
- Priority: JP2016-128324 20160629
- Main IPC: B23K1/20
- IPC: B23K1/20 ; H05K3/34 ; B23K3/08 ; B05B7/00 ; B05D1/02 ; B23K3/06 ; B05B7/24 ; B23K1/08 ; B23K101/42

Abstract:
There is provided a flux applying apparatus configured to jet and apply a flux to a target, whereby the flux applying apparatus is capable of rapidly collecting a surplus flux in a sub-tank and returning the same to the main tank for further jetting and applying. In particular, the flux applying apparatus is coupled to a control unit capable of estimating a flux amount trapped in the sub-tank on the basis of a time period for which the flux is to be jetted from the nozzle.
Public/Granted literature
- US20180001408A1 FLUX APPLYING APPARATUS Public/Granted day:2018-01-04
Information query
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