Invention Grant
- Patent Title: Method of processing surface of polysilicon and method of processing surface of substrate assembly
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Application No.: US15321537Application Date: 2016-03-07
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Publication No.: US10446410B2Publication Date: 2019-10-15
- Inventor: Xiaoyong Lu , Chunping Long , Chien Hung Liu , Yucheng Chan , Xiaolong Li , Zheng Liu
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Kinney & Lange, P.A.
- Priority: CN201510604497 20150921
- International Application: PCT/CN2016/075783 WO 20160307
- International Announcement: WO2017/049881 WO 20170330
- Main IPC: H01L21/321
- IPC: H01L21/321 ; H01L21/306 ; H01L21/768 ; H01L21/3105 ; H01L21/3213 ; H01L21/02 ; H01L21/48
Abstract:
Embodiments of the present invention provide a method of processing a surface of a polysilicon and a method of processing a surface of a substrate assembly. The method of processing a surface of a polysilicon includes forming a material film on the surface of the polysilicon; and processing, by using a chemico-mechanical polishing technology, the surface of the polysilicon on which the material film is formed. The material film is selected such that the polysilicon is preferentially removed in a polishing process.
Public/Granted literature
- US20170271171A1 METHOD OF PROCESSING SURFACE OF POLYSILICON AND METHOD OF PROCESSING SURFACE OF SUBSTRATE ASSEMBLY Public/Granted day:2017-09-21
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