Invention Grant
- Patent Title: Semiconductor device package comprising a dielectric layer with built-in inductor
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Application No.: US15599379Application Date: 2017-05-18
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Publication No.: US10475718B2Publication Date: 2019-11-12
- Inventor: Chien-Hua Chen , Hung-Yi Lin , Cheng-Yuan Kung , Teck-Chong Lee , Shiuan-Yu Lin
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L23/31 ; H01L23/00 ; H01L23/532 ; H01L21/683 ; H01L23/498 ; H01L25/065 ; H01L25/16

Abstract:
A semiconductor device package includes a dielectric layer, a first RDL, a second RDL, an inductor, a first electronic component and a second electronic component. The first RDL is adjacent to a first surface of the dielectric layer, and the first RDL includes first conductive pieces. The second RDL is adjacent to a second surface of the dielectric layer, and the second RDL includes second conductive pieces. The inductor is disposed in the dielectric layer. The inductor includes induction pillars, wherein each of the induction pillars is disposed through the dielectric layer, and each of the induction pillars is interconnected between a respective one of the first conductive pieces of the first RDL and a respective one of the second conductive pieces of the second RDL. The first electronic component and the second electronic component are between the first RDL and the second RDL, and electrically connected to each other through the inductor.
Public/Granted literature
- US20180337164A1 SEMICONDUCTOR DEVICE PACKAGE Public/Granted day:2018-11-22
Information query
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