Invention Grant
- Patent Title: Method for producing a semiconductor component and a semiconductor component
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Application No.: US15875955Application Date: 2018-01-19
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Publication No.: US10475773B2Publication Date: 2019-11-12
- Inventor: Matthew Meitl , Christopher Bower , Tansen Varghese
- Applicant: OSRAM Opto Semiconductors GmbH , X-Celeprint Limited
- Applicant Address: DE Regensburg IE Cork
- Assignee: OSRAM Opto Semiconductors GmbH,X-Celeprint Limited
- Current Assignee: OSRAM Opto Semiconductors GmbH,X-Celeprint Limited
- Current Assignee Address: DE Regensburg IE Cork
- Agency: Slater Matsil, LLP
- Main IPC: H01L25/075
- IPC: H01L25/075 ; H01L33/00 ; H01L33/50 ; H01L33/44 ; H01L21/78 ; H01L33/56 ; H01L33/22 ; H01L33/38 ; H01L33/60

Abstract:
A method for producing a plurality of semiconductor components and a semiconductor component are disclosed. In an embodiment the component includes a light transmissive carrier, a semiconductor body disposed on the light transmissive carrier, the semiconductor body including a first semiconductor layer, a second semiconductor layer and an active region being arranged between the first semiconductor layer and the second semiconductor layer, wherein the semiconductor body includes a first patterned main surface facing the light transmissive carrier and a second main surface facing away from the carrier and a contact structure including a first contact area and a second contact area arranged on the second main surface, wherein the second contact area is electrically connected to the second semiconductor layer, and wherein the contact structure comprises a via extending from the second main surface throughout the second semiconductor layer and the active region into the first semiconductor layer.
Public/Granted literature
- US20180145058A1 Method for Producing a Semiconductor Component and a Semiconductor Component Public/Granted day:2018-05-24
Information query
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