Invention Grant
- Patent Title: Package for a semiconductor die, method for making a die packaging bare die tape and method for semiconductor die packaging
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Application No.: US15638704Application Date: 2017-06-30
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Publication No.: US10483177B2Publication Date: 2019-11-19
- Inventor: Bassam Ziadeh , John Lofgren , Santosh Pabba , Kevin Pounds , Alin Ila
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: 2SPL Patent Attorneys PartG mbB
- Agent Kieran O'Leary
- Main IPC: H01L23/13
- IPC: H01L23/13 ; H01L23/31 ; H01L23/00 ; H05K13/00
Abstract:
A carrier medium for a semiconductor die includes a carrier tape with at least one pocket for the die to sit in and a selectively applied non-activated adhesive on the carrier tape.
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