公开(公告)号：US20190006251A1

公开(公告)日：2019-01-03

申请号：US15638704

申请日：2017-06-30

Applicant: Intel Corporation

Inventor： Bassam Ziadeh ,  John Lofgren ,  Santosh Pabba ,  Kevin Pounds ,  Alin Ila

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/00 ,  H05K13/00

CPC classification number: H01L23/13 ,  H01L21/6835 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2221/68309 ,  H01L2221/68313 ,  H05K13/0084

Abstract: A carrier medium for a semiconductor die includes a carrier tape with at least one pocket for the die to sit in and a selectively applied non-activated adhesive on the carrier tape.

公开(公告)号：US10483177B2

公开(公告)日：2019-11-19

申请号：US15638704

申请日：2017-06-30

Applicant: Intel Corporation

Inventor： Bassam Ziadeh ,  John Lofgren ,  Santosh Pabba ,  Kevin Pounds ,  Alin Ila

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/00 ,  H05K13/00

Abstract: A carrier medium for a semiconductor die includes a carrier tape with at least one pocket for the die to sit in and a selectively applied non-activated adhesive on the carrier tape.