公开(公告)号：US20190006251A1

公开(公告)日：2019-01-03

申请号：US15638704

申请日：2017-06-30

Applicant: Intel Corporation

Inventor： Bassam Ziadeh ,  John Lofgren ,  Santosh Pabba ,  Kevin Pounds ,  Alin Ila

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/00 ,  H05K13/00

CPC classification number: H01L23/13 ,  H01L21/6835 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2221/68309 ,  H01L2221/68313 ,  H05K13/0084

Abstract: A carrier medium for a semiconductor die includes a carrier tape with at least one pocket for the die to sit in and a selectively applied non-activated adhesive on the carrier tape.

公开(公告)号：US20230049007A1

公开(公告)日：2023-02-16

申请号：US17402313

申请日：2021-08-13

Applicant: Intel Corporation

Inventor： Khaled Ahmed ,  Anna M. Prakash ,  Ronald C. Woodbeck ,  Santosh Pabba

IPC: H01L33/00 ,  H01L21/683 ,  H01L33/62 ,  H01L33/60 ,  H01L33/20

Abstract: Micro light-emitting diodes (LED) are distanced from a mirror layer that reflects light emitted by the LEDs to increase the light extraction efficiency of the LEDs. In some embodiments, micro LEDs are electrically coupled to the mirror layer by vias positioned at an end of the LED positioned proximate to the mirror layer. In other embodiments, a conductive layer is positioned adjacent to an electrode of multiple micro LEDs and a pillar contacts the conductive layer at a location where the conductive layer is not positioned adjacent to a micro LED electrode. Vias and pillars allow the mirror height to be increased relative to structures where micro LEDs extend into a mirror layer. Increasing the mirror height can reduce the amount of destructive interference at a release layer caused by reflections of LED-emitted light by the mirror layer when the release layer is ablated via laser irradiation.

公开(公告)号：US10483177B2

公开(公告)日：2019-11-19

申请号：US15638704

申请日：2017-06-30

Applicant: Intel Corporation

Inventor： Bassam Ziadeh ,  John Lofgren ,  Santosh Pabba ,  Kevin Pounds ,  Alin Ila

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/00 ,  H05K13/00

Abstract: A carrier medium for a semiconductor die includes a carrier tape with at least one pocket for the die to sit in and a selectively applied non-activated adhesive on the carrier tape.