Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16039371Application Date: 2018-07-19
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Publication No.: US10483373B2Publication Date: 2019-11-19
- Inventor: Sun-Ki Min
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2017-0102415 20170811
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/66 ; H01L23/532 ; H01L21/762 ; H01L29/423 ; H01L21/033 ; H01L29/06 ; H01L21/28 ; H01L29/78 ; H01L29/49 ; H01L29/51

Abstract:
A semiconductor device including a first insulating interlayer on a substrate; a second insulating interlayer on the first insulating interlayer; a gate structure extending through the first insulating interlayer and the second insulating interlayer on the substrate, a lower portion of the gate structure having a first width, and an upper portion of the gate structure having a second width that is greater than the first width and that gradually increases from a bottom toward a top thereof; and a spacer structure on a sidewall of the gate structure, a width of an upper portion of the spacer structure being less than a width of a lower portion of the spacer structure.
Public/Granted literature
- US20190051730A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-02-14
Information query
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