Invention Grant
- Patent Title: Temperature instability-aware circuit
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Application No.: US16156507Application Date: 2018-10-10
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Publication No.: US10483973B2Publication Date: 2019-11-19
- Inventor: Chia-Hui Chen , Wan-Yen Lin , Tsung-Hsin Yu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: H03K19/003
- IPC: H03K19/003 ; H03K17/00 ; H03K3/356

Abstract:
A circuit includes: a first type of swing reduction circuit coupled between an input/output pad and a buffer circuit; and a second type of swing reduction circuit coupled between the input/output pad and the buffer circuit, wherein the first type of swing reduction circuit is configured to increase a voltage received by respective gates of a first subset of transistors of the buffer circuit when a voltage applied on the input/output pad is equal to a first supply voltage, and the second type of swing reduction circuit is configured to reduce a voltage received by respective gates of a second subset of transistors of the buffer circuit when the voltage applied on the input/output pad is equal to a second supply voltage.
Public/Granted literature
- US20190173471A1 TEMPERATURE INSTABILITY-AWARE CIRCUIT Public/Granted day:2019-06-06
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