Invention Grant
- Patent Title: Compositions including a high molecular weight acid suitable for conductive polymer formation on dielectric substrate
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Application No.: US15545208Application Date: 2016-01-20
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Publication No.: US10508207B2Publication Date: 2019-12-17
- Inventor: Christian Rietmann , Andreas Glöckner
- Applicant: MacDermid Enthone Inc.
- Applicant Address: US CT Waterbury
- Assignee: MacDermid Enthone Inc.
- Current Assignee: MacDermid Enthone Inc.
- Current Assignee Address: US CT Waterbury
- Agency: Carmody Torrance Sandak & Hennessey LLP
- International Application: PCT/IB2016/050277 WO 20160120
- International Announcement: WO2016/116876 WO 20160728
- Main IPC: C09D5/44
- IPC: C09D5/44 ; C25D5/56 ; H05K3/42 ; C25D3/38 ; C25D5/02

Abstract:
The invention relates to a composition and a process for the deposition of conductive polymers on dielectric substrates. In particular, the invention relates to a composition for the formation of electrically conductive polymers on the surface of a dielectric substrate, the composition comprising at least one polymerizable monomer which is capable to form a conductive polymer, an emulsifier and an acid, characterized in that the composition comprises at least one metal-ion selected from the group consisting of lithium-ions, sodium-ions, aluminum-ions, beryllium-ions, bismuth-ions, boron-ions, indium-ions and alkyl imidazolium-ions. The acid is typically a high molecular weight polymeric acid having molecular weight of at least 500,000 Da including, for example, polystyrene sulfonic acid having a molecular weight of approximately 1,000,000 Da.
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