Invention Grant
- Patent Title: Approach for ultra thin-film transfer and handling
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Application No.: US16013163Application Date: 2018-06-20
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Publication No.: US10509312B2Publication Date: 2019-12-17
- Inventor: Ping-Yin Liu , Chang-Ming Wu , Chia-Shiung Tsai , Xin-Hua Huang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G03F1/64

Abstract:
A method for forming a pellicle apparatus involves forming a device substrate by depositing one or more pellicle layers defined over a base device layer, where a release layer is formed thereover. An adhesive layer is formed over a transparent carrier substrate. The adhesive layer is bonded to the release layer, defining a composite substrate comprised of the device and carrier substrates. The base device layer is removed from the composite structure and a pellicle frame is attached to an outermost one of the pellicle layers. A pellicle region is isolated from a remainder of the composite structure, and an ablation of the release layer is performed through the transparent carrier substrate, defining the pellicle apparatus comprising a pellicle film attached to the pellicle frame. The pellicle apparatus is then from a remaining portion of the composite substrate.
Public/Granted literature
- US20190094682A1 NOVEL APPROACH FOR ULTRA THIN-FILM TRANSFER AND HANDLING Public/Granted day:2019-03-28
Information query
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