- Patent Title: Plating apparatus, substrate holder, plating apparatus controlling method, and storage medium configured to store program for instructing computer to implement plating apparatus controlling method
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Application No.: US16283611Application Date: 2019-02-22
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Publication No.: US10533262B2Publication Date: 2020-01-14
- Inventor: Jumpei Fujikata
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: EBARA CORPORATION
- Current Assignee: EBARA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Baker & Hostetler LLP
- Priority: JP2016-111802 20160603
- Main IPC: C25D17/06
- IPC: C25D17/06 ; C25D17/00 ; C25D7/12 ; C25D21/12 ; H01L21/288 ; H01L21/67 ; H01L21/687 ; H01L21/768 ; H01L23/00
Abstract:
Provided is a plating apparatus for plating a substrate by using a substrate holder including an elastic projection that seals a to-be-plated surface of the substrate, the plating apparatus comprising a measurement device configured to measure a deformed state of the elastic projection by measuring at least either one of a compression amount of the elastic projection and load applied to the elastic projection at a time when the substrate physically contacts the elastic projection of the substrate holder; and a controlling device configured to make a judgment on the basis of the measured deformed state as to whether sealing by the elastic projection is normal.
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