Invention Grant
- Patent Title: Metal foil with resin, and metal-clad laminate and circuit board using same
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Application No.: US15753571Application Date: 2016-09-02
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Publication No.: US10543661B2Publication Date: 2020-01-28
- Inventor: Akihiro Yamauchi , Yoshiaki Esaki , Takayoshi Ozeki , Hiroaki Umehara , Hiroharu Inoue , Yoshihiko Nakamura
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2015-179619 20150911
- International Application: PCT/JP2016/004017 WO 20160902
- International Announcement: WO2017/043062 WO 20170316
- Main IPC: B32B15/08
- IPC: B32B15/08 ; B32B15/092 ; C08G59/62 ; H05K1/03 ; C08G65/44 ; C08K3/36 ; C08L63/00

Abstract:
A metal foil with resin is a metal foil with resin including a metal foil and a resin layer disposed on the metal foil, resin layer being obtained by half-curing a resin composition. The resin composition contains a first component that is a polymer, a second component that is a polyarylene ether copolymer, and a third component that is an epoxy resin. The first component has structures represented by formulae (1) and (2) below, with no unsaturated bond between carbon atoms. The third component has two or more epoxy groups per molecule. The second component is compatible with the first component, and the third component is incompatible with the first component.In the formulae (1) and (2), a ratio between x and y is x:y=0:1 to 0.35:0.65, R1 represents hydrogen atom or methyl group, and R2 represents hydrogen atom or an alkyl group.
Public/Granted literature
- US20180250916A1 METAL FOIL WITH RESIN, AND METAL-CLAD LAMINATE AND CIRCUIT BOARD USING SAME Public/Granted day:2018-09-06
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