公开(公告)号：US11242425B2

公开(公告)日：2022-02-08

申请号：US17050671

申请日：2019-04-22

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Mikio Sato ,  Hiroaki Fujiwara ,  Yuki Kitai ,  Masashi Koda ,  Yasunori Hoshino ,  Takayoshi Ozeki

IPC: C08F290/06 ,  C08J5/24 ,  B32B15/08 ,  B32B27/28 ,  H05K1/03

Abstract: A resin composition is provided and contains a compound (A) having at least one group represented by the following Formula (1) in a molecule, a crosslinking type curing agent (B), and an azo compound (C) that has an azo group in a molecule and has no heteroatom other than a nitrogen atom constituting the azo group. In Formula (1), n represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group.

公开(公告)号：US10543661B2

公开(公告)日：2020-01-28

申请号：US15753571

申请日：2016-09-02

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Akihiro Yamauchi ,  Yoshiaki Esaki ,  Takayoshi Ozeki ,  Hiroaki Umehara ,  Hiroharu Inoue ,  Yoshihiko Nakamura

IPC: B32B15/08 ,  B32B15/092 ,  C08G59/62 ,  H05K1/03 ,  C08G65/44 ,  C08K3/36 ,  C08L63/00

Abstract: A metal foil with resin is a metal foil with resin including a metal foil and a resin layer disposed on the metal foil, resin layer being obtained by half-curing a resin composition. The resin composition contains a first component that is a polymer, a second component that is a polyarylene ether copolymer, and a third component that is an epoxy resin. The first component has structures represented by formulae (1) and (2) below, with no unsaturated bond between carbon atoms. The third component has two or more epoxy groups per molecule. The second component is compatible with the first component, and the third component is incompatible with the first component.In the formulae (1) and (2), a ratio between x and y is x:y=0:1 to 0.35:0.65, R1 represents hydrogen atom or methyl group, and R2 represents hydrogen atom or an alkyl group.

公开(公告)号：US10751976B2

公开(公告)日：2020-08-25

申请号：US16072715

申请日：2017-01-24

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. ,  TOMOEGAWA CO., LTD.

Inventor： Yohsuke Ishikawa ,  Yoshiaki Esaki ,  Takayoshi Ozeki ,  Jun Tochihira ,  Ryu Harada

IPC: B32B3/00 ,  B32B15/088 ,  B32B15/08 ,  H05K3/46 ,  B32B15/20 ,  B32B27/08 ,  B32B27/28 ,  B32B27/32 ,  B32B27/34 ,  B32B27/42 ,  H05K1/03

Abstract: A resin-clad metal foil which enables a reduction in fluidity of a resin during molding and a reduction in extrusion of the resin while maintaining good adhesiveness, bendability, thermal resistance, and circuit filling property. A first insulating layer includes a polyimide resin layer, a polyamideimide resin layer, a liquid crystal polymer resin layer, a fluororesin layer, or a polyphenylene ether resin layer and a second insulating layer includes a polyolefin resin layer in a semi-cured state are disposed in this order on a metal foil. The polyolefin resin layer contains a component representing a polyolefin-based elastomer and a component representing a thermosetting resin. The percentage by mass of the component in the polyolefin resin layer ranges from 50 wt. % to 95 wt. %.