公开(公告)号：US11866580B2

公开(公告)日：2024-01-09

申请号：US16957232

申请日：2018-10-16

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hiroaki Umehara ,  Fumito Suzuki ,  Jun Yasumoto ,  Hiroharu Inoue

IPC: C08L71/12 ,  C08K5/00 ,  C08K5/3492 ,  C08J5/24

CPC classification number: C08L71/126 ,  C08J5/244 ,  C08K5/0025 ,  C08K5/34924 ,  C08L2203/16 ,  C08L2203/202 ,  C08L2205/025 ,  C08L2312/00

Abstract: One aspect of the present application relates to a polyphenylene ether resin composition including a modified polyphenylene ether compound (A) that is terminally modified with a substituent having a carbon-carbon unsaturated double bond, and a crosslinking-type curing agent (B) having two or more carbon-carbon unsaturated double bonds in each molecule, the modified polyphenylene ether compound (A) including a modified polyphenylene ether compound (A-1) having a specific structure, and a modified polyphenylene ether compound (A-2) having a specific structure.

公开(公告)号：US11945910B2

公开(公告)日：2024-04-02

申请号：US16978599

申请日：2019-03-11

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hiroaki Umehara ,  Rihoko Watanabe ,  Hiroharu Inoue ,  Yiqun Wang

IPC: B32B3/10 ,  B32B15/08 ,  C08F222/40 ,  C08G65/48 ,  C08J5/24 ,  C08L25/06 ,  C08L47/00 ,  C08L71/12 ,  C08L79/08 ,  H05K1/03

CPC classification number: C08G65/485 ,  B32B15/08 ,  C08F222/40 ,  C08J5/244 ,  C08J5/249 ,  C08L25/06 ,  C08L47/00 ,  C08L71/126 ,  C08L79/08 ,  H05K1/0326 ,  H05K1/0346 ,  B32B2457/08 ,  C08F212/36 ,  C08F222/406

Abstract: One aspect of the present invention relates to a resin composition containing (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) a maleimide compound represented by the following formula (1):




wherein in the formula, p represents an integer of 1 to 10, in which the content ratio of the component (A) to the component (B) is (A):(B)=50:50 to 90:10 in mass ratio.

公开(公告)号：US10543661B2

公开(公告)日：2020-01-28

申请号：US15753571

申请日：2016-09-02

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Akihiro Yamauchi ,  Yoshiaki Esaki ,  Takayoshi Ozeki ,  Hiroaki Umehara ,  Hiroharu Inoue ,  Yoshihiko Nakamura

IPC: B32B15/08 ,  B32B15/092 ,  C08G59/62 ,  H05K1/03 ,  C08G65/44 ,  C08K3/36 ,  C08L63/00

Abstract: A metal foil with resin is a metal foil with resin including a metal foil and a resin layer disposed on the metal foil, resin layer being obtained by half-curing a resin composition. The resin composition contains a first component that is a polymer, a second component that is a polyarylene ether copolymer, and a third component that is an epoxy resin. The first component has structures represented by formulae (1) and (2) below, with no unsaturated bond between carbon atoms. The third component has two or more epoxy groups per molecule. The second component is compatible with the first component, and the third component is incompatible with the first component.In the formulae (1) and (2), a ratio between x and y is x:y=0:1 to 0.35:0.65, R1 represents hydrogen atom or methyl group, and R2 represents hydrogen atom or an alkyl group.

公开(公告)号：US12173151B2

公开(公告)日：2024-12-24

申请号：US18517442

申请日：2023-11-22

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hiroaki Umehara ,  Fumito Suzuki ,  Jun Yasumoto ,  Hiroharu Inoue

IPC: C08L71/12 ,  C08J5/24 ,  C08K5/00 ,  C08K5/3492

Abstract: One aspect of the present application relates to a polyphenylene ether resin composition including a modified polyphenylene ether compound (A) that is terminally modified with a substituent having a carbon-carbon unsaturated double bond, and a crosslinking-type curing agent (B) having two or more carbon-carbon unsaturated double bonds in each molecule, the modified polyphenylene ether compound (A) including a modified polyphenylene ether compound (A-1) having a specific structure, and a modified polyphenylene ether compound (A-2) having a specific structure.

公开(公告)号：US11066548B2

公开(公告)日：2021-07-20

申请号：US16880593

申请日：2020-05-21

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hiroaki Umehara ,  Hiroharu Inoue

IPC: C08L51/08 ,  C08J5/24 ,  B32B15/08 ,  C08L71/12 ,  C08L101/12 ,  C08F222/10 ,  C08L33/04 ,  H05K1/03 ,  C08L71/00 ,  C08F2/44 ,  C08G65/48 ,  C08F290/06 ,  H05K1/02

Abstract: A polyphenylene ether resin composition includes a modified polyphenylene ether copolymer, a high-molecular-weight compound, and a crosslinking agent for the modified polyphenylene ether copolymer. The modified polyphenylene ether copolymer includes a substituent having a carbon-carbon unsaturated double bond at a molecular chain end of the modified polyphenylene ether copolymer. The high-molecular-weight compound has a glass transition temperature (Tg) measured by differential scanning calorimetry of 20° C. or lower and has a number-average molecular weight Mn ranging from 1000 to 10000, inclusive. The crosslinking agent includes at least two carbon-carbon unsaturated double bonds per molecule, and includes at least one of dicyclopentadiene acrylate and dicyclopentadiene methacrylate. In a cured state of the polyphenylene ether resin composition, the modified polyphenylene ether copolymer is phase separated from the high-molecular-weight compound.

公开(公告)号：US12122129B2

公开(公告)日：2024-10-22

申请号：US16977384

申请日：2019-03-11

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hiroaki Umehara ,  Rihoko Watanabe ,  Hiroharu Inoue ,  Yiqun Wang

IPC: B32B27/28 ,  B32B15/08 ,  C08F112/08 ,  C08F120/14 ,  C08F222/40 ,  C08J5/04 ,  C08J5/18 ,  C08J5/24 ,  C08L71/12

CPC classification number: B32B27/281 ,  B32B15/08 ,  C08F112/08 ,  C08F120/14 ,  C08F222/404 ,  C08J5/043 ,  C08J5/18 ,  C08J5/244 ,  C08J5/249 ,  C08L71/126 ,  B32B2250/02 ,  B32B2250/03 ,  B32B2457/08 ,  C08F2810/40 ,  C08J2371/12 ,  C08F290/06 ,  C08F222/40

Abstract: One aspect of the present invention relates to a resin composition containing (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) at least one of maleimide compounds represented by the formulas (1) to (3).

公开(公告)号：US11365274B2

公开(公告)日：2022-06-21

申请号：US16978564

申请日：2019-03-11

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hiroaki Umehara ,  Yiqun Wang ,  Hiroharu Inoue

IPC: C08F290/06 ,  C08J5/24 ,  B32B15/08 ,  H05K1/05

Abstract: A resin composition is provided and includes (A) a modified polyphenylene ether compound terminal-modified with a substituent having a carbon-carbon unsaturated double bond, (B) a maleimide compound containing no phenylmaleimide group and having a hydrocarbon group having 10 or more carbon atoms in the molecule thereof, and (C) at least one selected from a maleimide compound containing a phenylmaleimide group and a maleimide compound having an aliphatic hydrocarbon group having 9 or less carbon atoms in the molecule thereof, in which the content ratio of the component (A) to the component (B) is (A):(B)=20:80 to 90:10 in mass ratio.