Invention Grant
- Patent Title: Plasma processing method
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Application No.: US16141225Application Date: 2018-09-25
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Publication No.: US10546723B2Publication Date: 2020-01-28
- Inventor: Akihiro Yokota , Takanori Banse , Joji Takayoshi , Shinya Morikita , Naohiko Okunishi
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: JP2017-185082 20170926
- Main IPC: H01L21/311
- IPC: H01L21/311 ; H01J37/32 ; H05H1/46 ; H01L21/02 ; H01L21/3105
Abstract:
A plasma processing method for a workpiece in a plasma processing apparatus includes (i) performing a first plasma processing on a workpiece, and (ii) performing a second plasma processing on the workpiece. Power of second radio frequency waves set in the second plasma processing is greater than the power of the second radio frequency waves set in the first plasma processing. In the second plasma processing, a magnetic field distribution having a horizontal component on an edge side of the workpiece greater than a horizontal component on a center of the workpiece is formed by an electromagnet.
Public/Granted literature
- US20190096635A1 PLASMA PROCESSING METHOD Public/Granted day:2019-03-28
Information query
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