Invention Grant
- Patent Title: Method and apparatus for building a 3D object from layers of pre-stripped substrate
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Application No.: US15751059Application Date: 2015-08-26
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Publication No.: US10556415B2Publication Date: 2020-02-11
- Inventor: David Ben-David , Eli Ireni , Michael Zimmer , Michael Karp , Claudio Rottman
- Applicant: HIGHCON SYSTEMS LTD.
- Applicant Address: IL Yavne
- Assignee: HIGHCON SYSTEMS LTD
- Current Assignee: HIGHCON SYSTEMS LTD
- Current Assignee Address: IL Yavne
- Agent Marc Van Dyke
- International Application: PCT/IB2015/056481 WO 20150826
- International Announcement: WO2017/033046 WO 20170302
- Main IPC: B32B37/18
- IPC: B32B37/18 ; B26F3/00 ; B26D7/18 ; B26D3/08 ; B29C64/393 ; B29C64/245 ; B29C64/147 ; B29C64/141 ; B33Y40/00 ; B33Y10/00 ; B32B38/10 ; B32B41/00 ; B32B38/04 ; B32B37/12 ; B32B38/00

Abstract:
Embodiments of the present invention relate to a system and method for manufacturing a three-dimensional object from a stack of pre-stripped layers of substrate. Each object layer is formed by (i) providing substrate comprising waste portion(s) and substrate-retained portion(s) that are attached to each other and separated from one another by cut(s) within the substrate; (ii) subsequently, subjecting the subject of each layer to a stripping process which selectively strips away substrate-waste portion(s) from the substrate-retained portion(s). After stripping, the object layer is added to a stack of previously-stacked object layers to grow the stack. This process is repeated to further grow the stack. Object layers of the stack are bonded to each other to build the three-dimensional object therefrom. Apparatus and methods for stripping are also described—any teaching or combination of teaching(s) related to stripping substrate may be employed in any additive-manufacturing process described herein.
Public/Granted literature
- US20180297348A1 METHOD AND APPARATUS FOR BUILDING A 3D OJBECT FROM LAYERS OF PRE-STRIPPED SUBSTRATE Public/Granted day:2018-10-18
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