公开(公告)号：US11780108B2

公开(公告)日：2023-10-10

申请号：US17171552

申请日：2021-02-09

Applicant: HIGHCON SYSTEMS LTD.

Inventor： David Ben-David ,  Eli Ireni ,  Michael Zimmer

IPC: B26D7/18 ,  B26D7/32 ,  B26D5/28 ,  B31B50/83 ,  B31B110/35 ,  B31B100/00 ,  B31B50/20 ,  B31B50/14

CPC classification number: B26D7/1818 ,  B26D5/28 ,  B26D7/18 ,  B26D7/32 ,  B31B50/83 ,  B26D2007/1809 ,  B31B50/14 ,  B31B50/20 ,  B31B2100/00 ,  B31B2110/35

Abstract: Methods and apparatus for stripping away portions of substrate are disclosed herein. In some embodiments, a flexible and/or soft impact-element(s) rotates around a rotation axis to drive a peripheral portion across a substrate plane of the substrate and/or to repeatedly collide with the substrate. At least some of the collisions are effective to partially dislodge or to strip away portion(s) of substrate.

公开(公告)号：US10556415B2

公开(公告)日：2020-02-11

申请号：US15751059

申请日：2015-08-26

Applicant: HIGHCON SYSTEMS LTD.

Inventor： David Ben-David ,  Eli Ireni ,  Michael Zimmer ,  Michael Karp ,  Claudio Rottman

IPC: B32B37/18 ,  B26F3/00 ,  B26D7/18 ,  B26D3/08 ,  B29C64/393 ,  B29C64/245 ,  B29C64/147 ,  B29C64/141 ,  B33Y40/00 ,  B33Y10/00 ,  B32B38/10 ,  B32B41/00 ,  B32B38/04 ,  B32B37/12 ,  B32B38/00

Abstract: Embodiments of the present invention relate to a system and method for manufacturing a three-dimensional object from a stack of pre-stripped layers of substrate. Each object layer is formed by (i) providing substrate comprising waste portion(s) and substrate-retained portion(s) that are attached to each other and separated from one another by cut(s) within the substrate; (ii) subsequently, subjecting the subject of each layer to a stripping process which selectively strips away substrate-waste portion(s) from the substrate-retained portion(s). After stripping, the object layer is added to a stack of previously-stacked object layers to grow the stack. This process is repeated to further grow the stack. Object layers of the stack are bonded to each other to build the three-dimensional object therefrom. Apparatus and methods for stripping are also described—any teaching or combination of teaching(s) related to stripping substrate may be employed in any additive-manufacturing process described herein.

公开(公告)号：US09492984B2

公开(公告)日：2016-11-15

申请号：US14530813

申请日：2014-11-02

Applicant: HIGHCON SYSTEMS LTD.

Inventor： David Ben-David ,  Yaki Stern ,  Yaron Smirnov ,  Tal Harmon

IPC: G06F7/00 ,  B31B1/74

CPC classification number: B31B1/74 ,  B31B50/00 ,  B31B50/006 ,  B31B50/04 ,  B31B50/98 ,  B31B2201/0235 ,  B31B2201/927 ,  B31B2201/95

Abstract: System and methods of treating or handling cardboard sheets.

Abstract translation: 处理或处理纸板的系统和方法。