公开(公告)号：US11667099B2

公开(公告)日：2023-06-06

申请号：US16304288

申请日：2017-05-25

Applicant: HIGHCON SYSTEMS LTD.

Inventor： Ron Or ,  Michael Karp ,  Claudio Rottman

IPC: B31F1/07 ,  B31F1/10 ,  B29C59/02 ,  B31F1/08 ,  B29C59/04 ,  B44B5/00 ,  B44B5/02

CPC classification number: B31F1/07 ,  B29C59/02 ,  B29C59/046 ,  B31F1/08 ,  B31F1/10 ,  B44B5/0047 ,  B44B5/026 ,  B31F2201/0702 ,  B31F2201/0733 ,  B31F2201/0738

Abstract: A die and counter die system for impressing a relief pattern onto a substrate, including a male die film and at least one female die. The female die includes a female-die contact surface including at least one cavity defining the relief pattern. The male die film includes a flexible male-die contact surface which is featureless in a region thereof opposing the relief pattern on the at least one female die. The system further includes a compression mechanism adapted, when the substrate is disposed between the male die contact surface and the female die contact surface, to move the male die film and the at least one female die towards one another so as to impress the relief pattern on the substrate.

公开(公告)号：US12194509B2

公开(公告)日：2025-01-14

申请号：US17285343

申请日：2019-11-04

Applicant: HIGHCON SYSTEMS LTD.

Inventor： Michael Karp

IPC: B08B1/20 ,  B08B1/10 ,  B08B1/50 ,  B08B11/02 ,  B23K26/38

Abstract: A system for cleaning a surface of a substrate includes a cleaning element including a resilient compressible material. A liquid source provides liquid directly to the cleaning element, and a squeezing roller engages the cleaning element and applies pressure thereto, to squeeze out excess liquid from said resilient compressible material. A counter element opposes said cleaning element such that the substrate is disposed between the counter element and the cleaning element. The substrate moves between the counter element and the cleaning element such that a surface of the cleaning element, having a suitable amount of liquid absorbed therein, engages and cleans the surface of the substrate without damaging the substrate.

公开(公告)号：US11135803B2

公开(公告)日：2021-10-05

申请号：US16304287

申请日：2017-05-25

Applicant: HIGHCON SYSTEMS LTD.

Inventor： Ron Or ,  Michael Karp ,  Claudio Rottman

IPC: B31F1/07 ,  B31F1/10 ,  B44B5/00 ,  B44B5/02 ,  B31F1/08 ,  B29C59/04

Abstract: A die and counter die system for impressing a relief pattern onto a substrate, including at least one male die including a contact surface and defining a relief pattern, a compressible counter film including a base layer, a contact layer disposed opposite the contact surface of the at least one male die and spaced therefrom, and a compressible layer disposed between the base layer and the contact layer and attached thereto. The contact layer is featureless in a region thereof opposing the relief pattern on the at least one male die. The compressible counter film has a compressibility, in a direction perpendicular to a broad face of the compressible counter film, in the range of 5-30% at 1.35 MPa. The system further includes a compression mechanism adapted to move the at least one male die and the compressible counter film towards one another in an operative mode.

公开(公告)号：US10556415B2

公开(公告)日：2020-02-11

申请号：US15751059

申请日：2015-08-26

Applicant: HIGHCON SYSTEMS LTD.

Inventor： David Ben-David ,  Eli Ireni ,  Michael Zimmer ,  Michael Karp ,  Claudio Rottman

IPC: B32B37/18 ,  B26F3/00 ,  B26D7/18 ,  B26D3/08 ,  B29C64/393 ,  B29C64/245 ,  B29C64/147 ,  B29C64/141 ,  B33Y40/00 ,  B33Y10/00 ,  B32B38/10 ,  B32B41/00 ,  B32B38/04 ,  B32B37/12 ,  B32B38/00

Abstract: Embodiments of the present invention relate to a system and method for manufacturing a three-dimensional object from a stack of pre-stripped layers of substrate. Each object layer is formed by (i) providing substrate comprising waste portion(s) and substrate-retained portion(s) that are attached to each other and separated from one another by cut(s) within the substrate; (ii) subsequently, subjecting the subject of each layer to a stripping process which selectively strips away substrate-waste portion(s) from the substrate-retained portion(s). After stripping, the object layer is added to a stack of previously-stacked object layers to grow the stack. This process is repeated to further grow the stack. Object layers of the stack are bonded to each other to build the three-dimensional object therefrom. Apparatus and methods for stripping are also described—any teaching or combination of teaching(s) related to stripping substrate may be employed in any additive-manufacturing process described herein.