Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
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Application No.: US15813833Application Date: 2017-11-15
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Publication No.: US10559613B2Publication Date: 2020-02-11
- Inventor: Sung In Kim , Jae Kyu Lee , Jae Rok Kahng
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2016-0180924 20161228
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L29/423 ; H01L29/08 ; H01L29/78 ; H04N5/374 ; H04N5/378

Abstract:
A semiconductor device and a method for fabricating the same are provided. The semiconductor device includes a substrate, first and second recesses spaced apart from each other in a first direction within the substrate, a first gate electrode filling the first recess and protruding above the substrate, a second gate electrode filling the second recess and protruding above the substrate, a first source/drain formed between the first and second recesses, a second source/drain formed in an opposite direction to the first source/drain with respect to the first recess, and a third source/drain formed in an opposite direction to the first source/drain with respect to the second recess and electrically connected to the second source/drain.
Public/Granted literature
- US20180182795A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2018-06-28
Information query
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