Printing devices and methods are provided that utilize high throughput extrusion to generate a printer material, such as a three-dimensional object. High-throughput extrusion systems as provided volumetrically pre-heat an extruded filament to a desired pre-heat temperature, and then either maintain or heat the extruded filament to a desired melt temperature prior to having the filament extruded out of the system and onto a surface, such as a build platform. By pre-heating the filament prior to heating it to the temperature at which it is excluded, it helps increase the throughput of the system. Likewise, by doing the heating volumetrically, it further helps increase the throughput of the system. Various embodiments of devices and methods typically used for printing in conjunction with the disclosed high throughput systems are also provided.