A temperature sensing system includes a temperature sensing element. The temperature sensing element is bondable to an exterior surface of an electronic component and configured to sense a temperature at an interior of the electronic component. The system further includes a flexible cable operatively connected to the temperature sensing element, and a signal conditioning unit operatively connected to a distal end of the flexible cable. The signal conditioning unit is mountable to a printed circuit board proximate to the electronic component. The signal conditioning unit is configured to receive a signal from the temperature sensing element, and output a signal indicative of the temperature at the interior of the electronic component.