Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16156062Application Date: 2018-10-10
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Publication No.: US10586852B2Publication Date: 2020-03-10
- Inventor: Jung Han Lee , Myung Il Kang , Jae Hwan Lee , Sun Wook Kim , Seong Ju Kim , Sung Jin Park , Hong Seon Yang , Joo Hee Jung
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee IP Law, PC
- Priority: KR10-2016-0148737 20161109
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L29/423 ; H01L29/78 ; H01L29/49 ; H01L29/66

Abstract:
A semiconductor device including a first fin protruding on a substrate and extending in a first direction; a first gate electrode on the first fin, the first gate electrode intersecting the first fin; a first trench formed within the first fin at a side of the first gate electrode; a first epitaxial layer filling a portion of the first trench, wherein a thickness of the first epitaxial layer becomes thinner closer to a sidewall of the first trench; and a second epitaxial layer filling the first trench on the first epitaxial layer, wherein a boron concentration of the second epitaxial layer is greater than a boron concentration of the first epitaxial layer.
Public/Granted literature
- US20190051728A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-02-14
Information query
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