Invention Grant
- Patent Title: Dual purpose heat pipe and antenna apparatus
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Application No.: US15609144Application Date: 2017-05-31
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Publication No.: US10594015B2Publication Date: 2020-03-17
- Inventor: Praveen Kumar , Bijendra Singh , Saku Lahti , Seppo Vesamaki , Marko Bonden
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01Q1/00
- IPC: H01Q1/00 ; F28D15/02 ; F28D15/04 ; F28F21/04 ; F28F21/06 ; H01Q1/02 ; H01Q1/42 ; H01R24/40 ; H01Q1/24 ; H01Q1/44 ; F28D21/00
Abstract:
A heat pipe is provided that is adapted for use as part of an antenna. The heat pipe includes a first conductive shell portion; a second conductive shell portion; and an insulating shell portion disposed between and connected to the first conductive shell portion and the second conductive shell portion. A wick structure is disposed within the sealed chamber.
Public/Granted literature
- US20180351230A1 DUAL PURPOSE HEAT PIPE AND ANTENNA APPARATUS Public/Granted day:2018-12-06
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