Invention Grant
- Patent Title: System and method for substrate processing chambers
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Application No.: US16230766Application Date: 2018-12-21
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Publication No.: US10600624B2Publication Date: 2020-03-24
- Inventor: Kalyanjit Ghosh , Sanjeev Baluja , Mayur G. Kulkarni , Shailendra Srivastava , Tejas Ulavi , Yusheng Alvin Zhou , Amit Kumar Bansal , Priyanka Dash , Zhijun Jiang , Ganesh Balasubramanian , Qiang Ma , Kaushik Alayavalli , Yuxing Zhang , Daniel Hwung , Shawyon Jafari
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Main IPC: H01J37/32
- IPC: H01J37/32 ; C23C16/52 ; C23C16/455 ; C23C16/40 ; C23C16/44 ; C23C16/50 ; C23C16/458
Abstract:
Systems and methods for depositing a film in a PECVD chamber while reducing residue buildup in the chamber. In some embodiments disclosed herein, a processing chamber includes a chamber body, a substrate support, a showerhead, and one or more heaters configured to heat the showerhead. In some embodiments, the processing chamber includes a controller.
Public/Granted literature
- US20190122872A1 SYSTEM AND METHOD FOR SUBSTRATE PROCESSING CHAMBERS Public/Granted day:2019-04-25
Information query
