公开(公告)号：US11853042B2

公开(公告)日：2023-12-26

申请号：US17177978

申请日：2021-02-17

Applicant: Applied Materials, Inc.

Inventor： Garrett Ho-Yee Sin ,  Sidharth Bhatia ,  Katty Marie Lydia Gamon Guyomard ,  Shawyon Jafari ,  Heng-Cheng Pai ,  Pramod Nambiar ,  Paul Lukas Brillhart ,  Ilker Durukan

IPC: G05B19/418 ,  G06N20/00 ,  G01N33/00 ,  G06F30/398 ,  G06F119/22 ,  G06F119/18

CPC classification number: G05B19/41875 ,  G01N33/00 ,  G06F30/398 ,  G06N20/00 ,  G01N2033/0095 ,  G05B2219/31264 ,  G05B2219/32179 ,  G05B2219/45031 ,  G06F2119/18 ,  G06F2119/22

Abstract: A method includes receiving part data associated with a corresponding part of substrate processing equipment, sensor data associated with one or more corresponding substrate processing operations performed by the substrate processing equipment to produce one or more corresponding substrates, and metrology data associated with the one or more corresponding substrates produced by the one or more corresponding substrate processing operations performed by the substrate processing equipment that includes the corresponding part. The method further includes generating sets of aggregated part-sensor-metrology data including a corresponding set of part data, a corresponding set of sensor data, and a corresponding set of metrology data. The method further includes causing analysis of the sets of aggregated part-sensor-metrology data to generate one or more outputs to perform a corrective action associated with the corresponding part of the substrate processing equipment.

公开(公告)号：US10883932B2

公开(公告)日：2021-01-05

申请号：US16455689

申请日：2019-06-27

Applicant: Applied Materials, Inc.

Inventor： Lin Zhang ,  Xuesong Lu ,  Andrew V. Le ,  Fa Ji ,  Jang Seok Oh ,  Patrick L. Smith ,  Shawyon Jafari ,  Ralph Peter Antonio

IPC: G01N21/53 ,  G01N1/22 ,  H01L21/67 ,  H01L21/677 ,  G01N15/00 ,  G01N15/06 ,  G01N15/02

Abstract: An FI having an in-situ particle detector and a method for particle detection therein are provided. In one aspect, the FI includes a fan, a substrate support, a particle detector, and an exhaust outlet. The fan, substrate support, and particle detector are arranged such that, in operation, the fan directs air towards the exhaust outlet and over a substrate on the substrate support to create laminar flow. The particle detector, positioned downstream from the substrate support and upstream from the exhaust outlet, analyzes the air and detects particle concentration before the particles are exhausted. The collected particle detection data may be combined with data from other sensors in the FI and used to identify the source of particle contamination. The particle detector may also be incorporated into other system components, including but not limited to, a load-lock or buffer chamber to detect particle concentration therein.

公开(公告)号：US11848218B2

公开(公告)日：2023-12-19

申请号：US17077711

申请日：2020-10-22

Applicant: Applied Materials, Inc.

Inventor： Katty Guyomard ,  Chidambara A. Ramalingam ,  Shawyon Jafari ,  Palash Joshi ,  Moin Ahmed Khan ,  Kirubanandan Naina Shanmugam ,  Subhaschandra Shreepad Salkod ,  Avishek Ghosh ,  David W. Groechel ,  Li Wu ,  Dorothea Buechel-Rimmel

IPC: H01L21/67 ,  B08B3/04

CPC classification number: H01L21/67057 ,  B08B3/048

Abstract: Exemplary semiconductor chamber component cleaning systems may include a receptacle. The receptacle may include a bottom lid that may be an annulus. The annulus may be characterized by an inner annular wall and an outer annular wall. A plurality of recessed annular ledges may be defined between the inner annular wall and the outer annular wall. Each recessed annular ledge of the plurality of recessed annular ledges may be formed at a different radial position along the bottom lid. The cleaning systems may include a top lid removably coupled with the bottom lid about an exterior region of the top lid. The cleaning systems may include a tank defining a volume to receive the receptacle.

公开(公告)号：US20220130692A1

公开(公告)日：2022-04-28

申请号：US17077711

申请日：2020-10-22

Applicant: Applied Materials, Inc.

Inventor： Katty Guyomard ,  Chidambara A. Ramalingam ,  Shawyon Jafari ,  Palash Joshi ,  Moin Ahmed Khan ,  Kirubanandan Naina Shanmugam ,  Subhaschandra Shreepad Salkod ,  Avishek Ghosh ,  David W. Groechel ,  Li Wu ,  Dorothea Buechel-Rimmel

IPC: H01L21/67 ,  B08B3/04

Abstract: Exemplary semiconductor chamber component cleaning systems may include a receptacle. The receptacle may include a bottom lid that may be an annulus. The annulus may be characterized by an inner annular wall and an outer annular wall. A plurality of recessed annular ledges may be defined between the inner annular wall and the outer annular wall. Each recessed annular ledge of the plurality of recessed annular ledges may be formed at a different radial position along the bottom lid. The cleaning systems may include a top lid removably coupled with the bottom lid about an exterior region of the top lid. The cleaning systems may include a tank defining a volume to receive the receptacle.

公开(公告)号：US20240145252A1

公开(公告)日：2024-05-02

申请号：US17979572

申请日：2022-11-02

Applicant: Applied Materials, Inc.

Inventor： Rutvij Naik ,  Vijay Sarthy Mysore Sreedhara ,  Xiaopu Li ,  Shawyon Jafari ,  Chidambara A. Ramalingam ,  Edward P. Hammond ,  Juan Carlos Rocha-Alvarez

IPC: H01L21/3065 ,  H01J37/32

CPC classification number: H01L21/3065 ,  H01J37/32623

Abstract: Exemplary semiconductor processing chamber faceplates may include a body having a first surface and a second surface opposite the first surface. The body may define a plurality of apertures that extend through one or both of the first surface and the second surface. The faceplates may include a heater disposed within an interior of the body. The faceplates may include a first RF mesh disposed between the heater and the first surface. The faceplates may include a second RF mesh disposed between the heater and the second surface. The first RF mesh and the second RF mesh may be coupled together and form a Faraday cage about the heater.

公开(公告)号：US20230302582A1

公开(公告)日：2023-09-28

申请号：US17703505

申请日：2022-03-24

Applicant: Applied Materials, Inc.

Inventor： Chidambara A. Ramalingam ,  Shawyon Jafari

IPC: B23K26/384 ,  B23K26/00 ,  B23K26/073

CPC classification number: B23K26/384 ,  B23K26/0093 ,  B23K26/073 ,  B23K2101/40

Abstract: Exemplary methods of fabricating a faceplate for a processing chamber may include drilling a first portion of each of a plurality of apertures in a first surface of a faceplate. Each first portion may extend at least partially through a thickness of the faceplate. The methods may include detecting a center of each first portion using a laser drilling apparatus. The methods may include drilling a diffuser portion in each of the plurality of apertures using the laser drilling apparatus. Each diffuser portion is centered with respect to a respective one of the first portions.

公开(公告)号：US20220333244A1

公开(公告)日：2022-10-20

申请号：US17235258

申请日：2021-04-20

Applicant: Applied Materials, Inc.

Inventor： Sumit Agarwal ,  Katherine Woo ,  Shawyon Jafari ,  Jian Li ,  Chidambara A. Ramalingam

IPC: C23C16/455 ,  B22D30/00

Abstract: Exemplary semiconductor processing chamber showerheads include an inner core region. The inner core region may define a plurality of apertures. The showerheads may include an outer core region disposed about an outer periphery of the inner core region. The outer core region may define an annular channel. The showerheads may include a heating element disposed within the annular channel. The showerheads may include an annular liner disposed about an outer periphery of the outer core region. The inner core region and the outer core region may include an aluminum alloy. The annular liner may have a lower thermal conductivity than the aluminum alloy.

公开(公告)号：US10365216B2

公开(公告)日：2019-07-30

申请号：US15793458

申请日：2017-10-25

Applicant: Applied Materials, Inc.

Inventor： Lin Zhang ,  Xuesong Lu ,  Andrew V. Le ,  Fa Ji ,  Jang Seok Oh ,  Patrick L. Smith ,  Shawyon Jafari ,  Ralph Peter Antonio

IPC: G01N21/53 ,  G01N1/22 ,  H01L21/67 ,  H01L21/677 ,  G01N15/02 ,  G01N15/00 ,  G01N15/06

Abstract: An FI having an in-situ particle detector and a method for particle detection therein are provided. In one aspect, the FI includes a fan, a substrate support, a particle detector, and an exhaust outlet. The fan, substrate support, and particle detector are arranged such that, in operation, the fan directs air towards the exhaust outlet and over a substrate on the substrate support to create laminar flow. The particle detector, positioned downstream from the substrate support and upstream from the exhaust outlet, analyzes the air and detects particle concentration before the particles are exhausted. The collected particle detection data may be combined with data from other sensors in the FI and used to identify the source of particle contamination. The particle detector may also be incorporated into other system components, including but not limited to, a load-lock or buffer chamber to detect particle concentration therein.

公开(公告)号：US20240061409A1

公开(公告)日：2024-02-22

申请号：US18495724

申请日：2023-10-26

Applicant: Applied Materials, Inc.

Inventor： Garrett Ho-Yee Sin ,  Sidharth Bhatia ,  Katty Marie Lydia Gamon Guyomard ,  Shawyon Jafari ,  Heng-Cheng Pai ,  Pramod Nambiar ,  Paul Lukas Brillhart ,  Ilker Durukan

IPC: G05B19/418 ,  G06N20/00 ,  G01N33/00 ,  G06F30/398

CPC classification number: G05B19/41875 ,  G06N20/00 ,  G01N33/00 ,  G06F30/398 ,  G06F2119/22

Abstract: A method includes identifying sets of part data associated with substrate processing equipment. Each of the sets of part data includes corresponding part values and a corresponding part identifier. Each of the sets of part data is associated with hardware parameters of a corresponding equipment part of substrate processing equipment. The method further includes generating sets of aggregated data. Each of the sets of aggregated data includes a corresponding set of part data of the sets of part data and a corresponding set of additional non-part data of sets of non-part data. The method further includes causing, based on the sets of aggregated data, performance of a corrective action associated with the substrate processing equipment.

公开(公告)号：US11851758B2

公开(公告)日：2023-12-26

申请号：US17235258

申请日：2021-04-20

Applicant: Applied Materials, Inc.

Inventor： Sumit Agarwal ,  Katherine Woo ,  Shawyon Jafari ,  Jian Li ,  Chidambara A. Ramalingam

IPC: C23C16/455 ,  B22D30/00

CPC classification number: C23C16/45565 ,  B22D30/00 ,  C23C16/45525 ,  Y10T29/49433

Abstract: Methods of manufacturing a semiconductor processing chamber showerheads may include forming a melted aluminum alloy composition, cooling the melted aluminum alloy composition at a rate of at least 103 K/sec to form solid aluminum alloy particles, and forming a core region of a showerhead from the solid aluminum alloy particles. The core region of the showerhead may include an inner core region and an outer core region that may be coupled together. The inner core region may define a plurality of apertures. The outer core region may define a channel that receives a heating element. The methods may include coating the core region with one of aluminum or aluminum oxide and joining a peripheral edge of the outer core region with an inner edge of a metallic annular liner. The metallic annular liner may have a lower thermal conductivity than the core region of the showerhead.