Invention Grant
- Patent Title: USB chipset
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Application No.: US16050103Application Date: 2018-07-31
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Publication No.: US10606788B2Publication Date: 2020-03-31
- Inventor: Wei-Yu Wang , Yu-Chung Wei , Yinglien Cheng
- Applicant: VIA TECHNOLOGIES, INC.
- Applicant Address: TW New Taipei
- Assignee: VIA LABS, INC.
- Current Assignee: VIA LABS, INC.
- Current Assignee Address: TW New Taipei
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW104129740A 20150909
- Main IPC: G06F13/38
- IPC: G06F13/38 ; G06F13/40 ; G06F13/42

Abstract:
The USB chipset including a data processing unit, a transmitting unit, a first pin set and a second pin set is provided. The data processing unit generates a plurality of transmission information according to first information provided by a first device. The transmitting unit processes the transmission information to generate an output signal. The first pin set is configured to transmit the output signal to a second device. The second pin set is configured to transmit the output signal to the second device. When the first pin set transmits the output signal to the second device, the second pin set does not transmit the output signal to the second device. When the second pin set transmits the output signal to the second device, the first pin set does not transmit the output signal to the second device.
Public/Granted literature
- US20180336156A1 USB CHIPSET Public/Granted day:2018-11-22
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