Invention Grant
- Patent Title: Chip mounting apparatus and method using the same
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Application No.: US15869405Application Date: 2018-01-12
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Publication No.: US10607877B2Publication Date: 2020-03-31
- Inventor: Jin Sub Lee , Han Kyu Seong , Yong Il Kim , Sung Hyun Sim , Dong gun Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2017-0079749 20170623
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/683 ; H01L23/00 ; H01L21/67 ; H01L33/00 ; H01L33/62 ; H01L25/075 ; H01L21/66 ; B23K26/00

Abstract:
A chip mounting method includes providing a first substrate including a light transmissive substrate having first and second surfaces, a sacrificial layer provided on the first surface, and a plurality of chips bonded to the sacrificial layer, obtaining first mapping data by testing the chips, the first mapping data defining coordinates of normal chips and defective chips among the chips, disposing a second substrate below the first surface, disposing the normal chips on the second substrate by radiating a first laser beam to positions of the sacrificial layer corresponding to the coordinates of the normal chips, based on the first mapping data, to remove portions of the sacrificial layer thereby separating the normal chips from the light transmissive substrate, and mounting the normal chips on the second substrate by radiating a second laser beam to a solder layer of the second substrate.
Public/Granted literature
- US20180374738A1 CHIP MOUNTING APPARATUS AND METHOD USING THE SAME Public/Granted day:2018-12-27
Information query
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