Invention Grant
- Patent Title: Memory arrays
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Application No.: US15973697Application Date: 2018-05-08
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Publication No.: US10607995B2Publication Date: 2020-03-31
- Inventor: Martin C. Roberts , Sanh D. Tang , Fred D. Fishburn
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L29/08 ; H01L29/10 ; H01L49/02 ; H01L23/528 ; H01L29/423 ; H01L27/11504 ; H01L27/11507 ; H01L27/11514 ; H01L21/28 ; H01L21/02 ; H01L21/306 ; H01L21/311 ; H01L21/3213 ; H01L27/06

Abstract:
A memory array comprises vertically-alternating tiers of insulative material and memory cells. The memory cells individually include a transistor comprising first and second source/drain regions having a channel region there-between and a gate operatively proximate the channel region. At least a portion of the channel region is horizontally-oriented for horizontal current flow in the portion between the first and second source/drain regions. The memory cells individually include a capacitor comprising first and second electrodes having a capacitor insulator there-between. The first electrode is electrically coupled to the first source/drain region. The second capacitor electrodes of multiple of the capacitors in the array are electrically coupled with one another. A sense-line structure extends elevationally through the vertically-alternating tiers. Individual of the second source/drain regions of individual of the transistors that are in different memory cell tiers are electrically coupled to the elevationally-extending sense-line structure. Additional embodiments are disclosed.
Public/Granted literature
- US20180323199A1 Memory Arrays Public/Granted day:2018-11-08
Information query
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