Invention Grant
- Patent Title: Diffusion barriers
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Application No.: US16081713Application Date: 2016-03-31
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Publication No.: US10651082B2Publication Date: 2020-05-12
- Inventor: Daniel J. Zierath , Jason A. Farmer , Daniel B. Bergstrom
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- International Application: PCT/US2016/025139 WO 20160331
- International Announcement: WO2017/171767 WO 20171005
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/532 ; C23C16/34 ; C23C16/455 ; H01L21/285

Abstract:
In an example, there is disclosed a chemical compound, including a transition metal, a post-transition metal, a metalloid, and a nonmetal. By way of non-limiting example, the post-transition metal may be aluminum. The transition metal is selected from the group consisting of tungsten, tantalum, hafnium, molybdenum, niobium, zirconium, vanadium, and titanium. The metalloid may be boron or silicon. The nonmetal may be carbon or nitrogen. The compound may be used, for example, as a barrier material in an integrated circuit.
Public/Granted literature
- US20190088538A1 DIFFUSION BARRIERS Public/Granted day:2019-03-21
Information query
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