- 专利标题: Reduced transistor resistance using doped layer
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申请号: US16325423申请日: 2016-09-30
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公开(公告)号: US10651313B2公开(公告)日: 2020-05-12
- 发明人: Cheng-Ying Huang , Matthew V. Metz , Gilbert Dewey , Willy Rachmady , Jack T. Kavalieros , Sean T. Ma
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Trop, Pruner & Hu, P.C.
- 国际申请: PCT/US2016/054889 WO 20160930
- 国际公布: WO2018/063363 WO 20180405
- 主分类号: H01L27/088
- IPC分类号: H01L27/088 ; H01L29/786 ; H01L29/06 ; H01L29/423 ; B82Y10/00 ; H01L29/66 ; H01L29/775 ; H01L29/78 ; H01L29/417 ; H01L21/8234 ; H01L29/08 ; H01L27/24
摘要:
An embodiment includes a transistor comprising: first, second, and third layers each including a group III-V material; a channel included in the second layer, which is between the first and third layers; and a gate having first and second gate portions; wherein (a)(i) the first and third layers are doped, (a)(ii) the channel is between the first and second gate portions and the second gate portion is between the channel and a substrate, (a)(iii) a first axis intersects the first, second, and third layers but not the first gate portion, and (a)(iv) a second axis, parallel to the first axis, intersects the first and second gate portions and the channel. Other embodiments are described herein.
公开/授权文献
- US20190214500A1 REDUCED TRANSISTOR RESISTANCE USING DOPED LAYER 公开/授权日:2019-07-11
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