Invention Grant
- Patent Title: Assembly including a carrier having a glass material and an optoelectronic semiconductor component
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Application No.: US15775038Application Date: 2016-11-10
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Publication No.: US10651346B2Publication Date: 2020-05-12
- Inventor: Frank Singer , Andreas Ploessl
- Applicant: OSRAM OLED GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM OLED GmbH
- Current Assignee: OSRAM OLED GmbH
- Current Assignee Address: DE Regensburg
- Agency: DLA Piper LLP (US)
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@59fcae2
- International Application: PCT/EP2016/077316 WO 20161110
- International Announcement: WO2017/081184 WO 20170518
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L33/50 ; H01L33/62 ; H01L25/13
Abstract:
An assembly includes a carrier including a glass material, including at least one recess, wherein at least one optoelectronic semiconductor component is arranged in the at least one recess of the carrier, and at least one surface of the semiconductor component connects to the carrier via a melted surface including glass.
Public/Granted literature
- US20180374996A1 ASSEMBLY INCLUDING A CARRIER HAVING A GLASS MATERIAL AND AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT Public/Granted day:2018-12-27
Information query
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