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    Optoelectronic semiconductor device having a side face as mounting side
    3.
    发明授权
    Optoelectronic semiconductor device having a side face as mounting side 有权

    公开(公告)号：US11276803B2

    公开(公告)日：2022-03-15

    申请号：US15534155

    申请日：2015-12-04

    Applicant: OSRAM OLED GmbH

    Inventor： Thomas Schwarz ,  Frank Singer

    IPC: H01L33/54 ,  H01L33/48 ,  H01L33/62 ,  H01L33/00 ,  H01L23/00 ,  H01L33/60 ,  H01L21/56

    Abstract: In an embodiment an optoelectronic semiconductor device includes a semiconductor chip having a semiconductor layer sequence with an active region, a radiation exit surface arranged parallel to the active region and a plurality of side faces arranged obliquely or perpendicular to the radiation exit surface. The device further includes a contact track electrically connecting the semiconductor chip to a contact surface configured to externally contact the semiconductor device, a molding and a rear side of the semiconductor chip remote from the radiation exit surface, the rear side being free of a material of the molding, wherein one of the side faces is configured as a mounting side face for fastening of the semiconductor device, and wherein the contact track partially runs on one of the side faces.

    Method for producing optoelectronic semiconductor devices and optoelectronic semiconductor device
    4.
    发明授权
    Method for producing optoelectronic semiconductor devices and optoelectronic semiconductor device 有权

    公开(公告)号：US10964861B2

    公开(公告)日：2021-03-30

    申请号：US16866890

    申请日：2020-05-05

    Applicant: OSRAM OLED GmbH

    Inventor： Markus Pindl ,  Thomas Schwarz ,  Frank Singer ,  Sandra Sobczyk

    IPC: H01L33/54 ,  H01L33/00 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/50 ,  H01L33/48 ,  H01L33/56 ,  H01L21/56

    Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.

    COMPOSITE COMPONENT MADE OF OPTICAL COMPONENTS, METHOD FOR PRODUCING A COMPOSITE COMPONENT AND DEVICE COMPRISING AN OPTICAL COMPONENT
    5.
    发明申请
    COMPOSITE COMPONENT MADE OF OPTICAL COMPONENTS, METHOD FOR PRODUCING A COMPOSITE COMPONENT AND DEVICE COMPRISING AN OPTICAL COMPONENT 有权

    公开(公告)号：US20210048594A1

    公开(公告)日：2021-02-18

    申请号：US16977174

    申请日：2019-02-05

    Applicant: OSRAM OLED GmbH

    Inventor： Frank Singer ,  Hubert Halbritter

    IPC: G02B7/02 ,  G02B3/00 ,  H01S5/026 ,  H01S5/022

    Abstract: A composite component, a device, and method for producing the composite component including a plurality of optical components, a removable sacrificial layer, a retaining structure and a common intermediate carrier are provided, wherein the optical components each have an optical element for shaping a light beam and the sacrificial layer is arranged in the vertical direction at least in places between the intermediate carrier and the optical components. The retaining structure includes retaining elements, wherein the retaining structure and the sacrificial layer form a mechanical connection between the intermediate carrier and the optical components. The optical components are mechanically connected to the intermediate carrier only via the retaining structure, wherein the retaining elements are formed in such a way that under mechanical load they release the optical components so that the optical components are formed to be detachable from the intermediate carrier and thus transferable.

    Light-emitting component and method of producing a light-emitting component
    6.
    发明授权
    Light-emitting component and method of producing a light-emitting component 有权

    公开(公告)号：US10854804B2

    公开(公告)日：2020-12-01

    申请号：US15565239

    申请日：2016-04-07

    Applicant: OSRAM OLED GmbH

    Inventor： Martin Haushalter ,  Frank Singer ,  Thomas Schwarz ,  Andreas Ploessl

    IPC: H01L33/60 ,  H01L33/64 ,  H01L33/00 ,  H01L33/48 ,  H01L33/62

    Abstract: A light-emitting component includes a light-emitting chip and a housing including a plastic body and a reflector, the reflector includes an electrically conductive layer, the light-emitting chip includes a top side and an underside, the underside of the light-emitting chip is arranged on the plastic body, an electrical terminal on the top side of the light-emitting chip electrically conductively connects to the reflector by a bond wire, the underside of the light-emitting chip and the reflector are electrically insulated from one another, a conduction region is provided within the plastic body, thermal conductivity of the conduction region is greater than thermal conductivity of the plastic body, the conduction region adjoins the underside of the light-emitting chip, and the conduction region extends from the side of the plastic body facing the light-emitting chip as far as the side of the plastic body facing away from the light-emitting chip.

    Light-emitting module and display device comprising same
    7.
    发明授权
    Light-emitting module and display device comprising same 有权

    公开(公告)号：US10763396B2

    公开(公告)日：2020-09-01

    申请号：US16086828

    申请日：2017-03-29

    Applicant: OSRAM OLED GMBH

    Inventor： Jürgen Moosburger ,  Matthias Sabathil ,  Frank Singer

    IPC: H01L33/50 ,  H01L33/24 ,  H01L27/15 ,  H05B45/00 ,  H05B45/58 ,  H01L25/075

    Abstract: A light-emitting module and a display device including the same are disclosed. In an embodiment a light-emitting module includes a plurality of emission regions configured to emit light, at least one first emission region and at least one second emission region of a first type configured to emit light of a first color locus and at least one first emission region and at least one second emission region of a second type configured to emit light of a second color locus and a control device for supplying the emission regions with current, wherein the emission regions are arranged on a common semiconductor chip, wherein the first color locus is different from the second color locus, wherein the first and second emission regions of the first type are adjacent to one another, and wherein the first and second emission regions of the second type are adjacent to one another.

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