Invention Grant
- Patent Title: Electrodeposition system
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Application No.: US15672553Application Date: 2017-08-09
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Publication No.: US10655023B2Publication Date: 2020-05-19
- Inventor: Victoria J Gelling , Tapan DebRoy , Chun Ren
- Applicant: Valspar Sourcing, Inc.
- Applicant Address: US OH Cleveland
- Assignee: The Sherwin Williams Company
- Current Assignee: The Sherwin Williams Company
- Current Assignee Address: US OH Cleveland
- Agency: Merchant & Gould P.C.
- Main IPC: C09D5/44
- IPC: C09D5/44 ; C08G18/80 ; B01J23/18 ; C08G18/22 ; C09D7/40 ; C08G59/68 ; C09D7/61 ; C09D175/04 ; C08G18/76 ; C25D13/12 ; C08G59/06 ; C08G18/32 ; C08G59/40 ; C08G59/24 ; C09D163/00 ; B01J37/02 ; B01J37/34 ; C08G18/58 ; C08G18/28 ; C08K3/11 ; C25D13/20 ; C08K3/08 ; C08K3/22 ; C08K3/24
Abstract:
An electrocoat system for electrodeposition is described. The system includes an inorganic bismuth-containing compound or a mixture of inorganic and organic bismuth-containing compounds. The system demonstrates a high degree of crosslinking and produces a cured coating with optimal crosslinking and corrosion resistance.
Public/Granted literature
- US20170335120A1 Novel Electrodeposition System Public/Granted day:2017-11-23
Information query
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