Invention Grant
- Patent Title: Pressure-sensitive adhesive composition, process for producing same, and pressure-sensitive adhesive film
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Application No.: US15752638Application Date: 2016-07-12
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Publication No.: US10662355B2Publication Date: 2020-05-26
- Inventor: Manami Saito , Hiroyoshi Kurihara
- Applicant: MITSUI CHEMICALS TOHCELLO, INC.
- Applicant Address: JP Chiyoda-Ku, Tokyo
- Assignee: MITSUI CHEMICALS TOHCELLO, INC.
- Current Assignee: MITSUI CHEMICALS TOHCELLO, INC.
- Current Assignee Address: JP Chiyoda-Ku, Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@613bd81e
- International Application: PCT/JP2016/070599 WO 20160712
- International Announcement: WO2017/043173 WO 20170316
- Main IPC: C09J133/06
- IPC: C09J133/06 ; C09J175/14 ; C09J7/38 ; C09J11/06 ; C09J201/06 ; C09J175/04 ; C09J5/00 ; C08K5/098 ; C08K5/17
Abstract:
The present invention is an adhesive composition that is characterized by including (A) a polymer comprising a structural unit having a hydroxy group in a side chain, (B) a compound having two or more isocyanate groups, (C) a bismuth carboxylate, and (D) a tertiary amine having a pKa of 6 or more. The polymer (A) may include further a structural unit having a urethane bond and a polymerizable unsaturated bond in a side chain.
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