Abstract:
Provided is an adhesive as follows. The adhesive can bond/secure an adherend to a support with maintaining high adhesiveness during the existence of the need for securing of the adherend to the support, even in a high-temperature environment or in an environment with abrupt temperature change. The adhesive enables debonding of the adherend from the support without breakage of the adherend when the securing becomes unnecessary. The adhesive can be easily removed when remained on the adherend after debonding. The adhesive according to the present invention contains (A) a multivalent vinyl ether compound, (B) a compound including two or more of a constitutional unit represented by Formula (b), and (C) a thermoplastic resin. In the formula, X is selected from hydroxy and carboxy.
Abstract:
A curable resin composition, comprising a compound represented by the following general formula (1): wherein X is a functional group comprising a reactive group, and R1 and R2 each independently represent a hydrogen atom, or an aliphatic hydrocarbon group, aryl group or heterocyclic group that may have a substituent; and at least organometallic compound selected from the group consisting of metal alkoxides and metal chelates.
Abstract:
A laminating adhesive is prepared from a water-borne resin obtained by allowing an isocyanate group-terminated prepolymer having an anionic group to react with a chain extender; a swellable inorganic layer compound; and a water dispersible polyisocyanate curing agent.
Abstract:
In one aspect the invention is a composition comprising a prepolymer which is the reaction product of di(isocyanatophenyl) methane or a polymeric di(isocyanatophenyl) methane having an isocyanato functionality of about 2.1 to about 3.0 with a mixture of one or more diols and one or more triols wherein the ratio of isocyanate equivalents to hydroxyl equivalents in the reaction mixtures used to prepare the prepolymer is from about 1.2 to about 1.8 and the ratio of diol to triol where the diisocyanate is a di(isocyanatophenyl) methane in the reaction mixture is from about 5:1 to about 1:1. and where the isocyanate is a polymeric di(isocyanatophenyl) methane is from about 8:1 to about 4:1; wherein the prepolymer could further react with an isocyanate reactive monofunctional compound. The prepolymer herein has an isocyanate content of about 0.5 to about 1.5 percent by weight, a free isocyanate monomer content of about 1.0 percent by weight or less as measured by high pressure liquid chromatography. These prepolymers can be used in many applications including adhesive, sound dampening sealer and coating and especially in making adhesives or adhesive systems with a low content of monomeric isocyanate to bond together similar or dissimilar substrates such as metal, glass, ceramics, plastic and painted steel panel.
Abstract:
Disclosed is a thermoplastic adhesive comprising a modified polyolefin resin having a branch chain having at least one carbonyl group and at least one benzene nucleus in one side chain. This adhesive shows a strong bonding force to a chlorine-containing polymer or an aromatic group-containing polymer such as a polyester and is especially valuable for the production of a laminate of such a resin and a polyolefin. A blend or block copolymer comprising an olefin resin component that can contain a carboxyl group and a carbon-to-carbon chain resin component having a benzoic acid ester or cinnamic acid ester group in the side chain is especially excellent in the bonding characteristics, particularly the heat-resistance adhesion.
Abstract:
Provided is a photo-crosslinkable PSA comprising a polymer having side-chain benzophenone structures. The photo-crosslinkable PSA is a cured product of a PSA composition comprising an ethylenically unsaturated compound and a benzophenone structure-containing component. The photo-crosslinkable PSA has VOC emissions of 500 μg/g or less. Also provided is a PSA sheet having a PSA layer formed from the photo-crosslinkable PSA.
Abstract:
A printing ink composition for laminate contains a pigment, a binder resin, a polyfunctional isocyanate compound as curing agent, and an organic solvent, wherein the binder resin is a polyurethane resin and a vinyl chloride-vinyl acetate copolymer; at least one of the polyurethane resin and vinyl chloride-vinyl acetate copolymer has a reactive group that can react with the isocyanate group in the polyfunctional isocyanate compound; the ratio of the solid content of the polyurethane resin and that of the vinyl chloride-vinyl acetate copolymer is in a range of 9/1 to 1/9 (polyurethane resin/vinyl chloride-vinyl acetate copolymer); and the ratio of the sum of the solid contents of the polyurethane resin and vinyl chloride-vinyl acetate copolymer and the solid content of the curing agent is in a range of 1:0.2 to 0.9 ((polyurethane resin+copolymer):curing agent).
Abstract:
A photocationically polymerizable adhesive composition and an optical member, the photocationically polymerizable adhesive composition including about 75 to about 99.8 parts by weight of a compound including one of aliphatic epoxy, alicyclic epoxy, oxetane, and vinyl ether compounds, about 0.1 to about 5 parts by weight of a titanate coupling agent, and about 0.1 to about 20 parts by weight of a photopolymerization initiator, wherein a sum of weights of the compound, the titanate coupling agent, and the photopolymerization initiator is 100 parts by weight.
Abstract:
Macrocyclic compounds, e.g., ketones, crown ethers, methicones etc., have been found to be effective co-solvents in solvent based adhesives for pipe joining applications. Because of their enhanced solubility with VOC exempt solvents (40 C.F.R. 51.100), the calculated VOC content of the adhesive can be lowered to at least 75% of those established by SCAQMD Rule 116A.
Abstract:
A composition for forming a moisture resistant, anisotropic conductive film having a rapid curing speed, high heat resistance, high humidity resistance, long shelf life and excellent repairability comprising an adhesive composition containing about 100 parts cyanate ester, from about 0.01 part to 10 parts of a curing catalyst, from about 10 parts to about 300 parts of a film-formable thermoplastic resin, and from about 10 to about 500 parts of an epoxy resin, and from about 0.1 part to about 20 parts conductive particles per 100 parts total adhesive composition.