公开(公告)号：US11482441B2

公开(公告)日：2022-10-25

申请号：US16089834

申请日：2017-03-21

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Hiroyoshi Kurihara ,  Hideki Fukumoto

IPC: H01L21/683 ,  H01L21/306 ,  H01L21/67 ,  H01L23/60 ,  H01L23/00

Abstract: A method for manufacturing a semiconductor device includes at least the following three steps: (A) A step of preparing a structure including a semiconductor wafer having a circuit-formed surface and an adhesive film attached to the circuit-formed surface side of the semiconductor wafer; (B) A step of back grinding a surface on a side opposite to the circuit-formed surface side of the semiconductor wafer; and (C) A step of radiating ultraviolet rays to the adhesive film and then removing the adhesive film from the semiconductor wafer. The adhesive film includes a base material layer and an ultraviolet-curable adhesive resin layer provided on one surface side thereof. The adhesive resin layer includes an ultraviolet-curable adhesive resin, and a saturated electrostatic potential V1 of a surface of the adhesive resin layer after ultraviolet curing, which is measured using a specific method, is equal to or less than 2.0 kV.

公开(公告)号：US12142522B2

公开(公告)日：2024-11-12

申请号：US17596021

申请日：2020-05-13

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Toru Miura ,  Hiroyoshi Kurihara

IPC: H01L21/768 ,  H01L21/02 ,  H01L21/263

Abstract: A method for manufacturing an electronic device includes at least a step (1) of preparing a structure comprising (i) an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, and an adhesive resin layer (B) provided on a second surface side of the base material layer, (ii) an electronic component attached to the adhesive resin layer (A) of the adhesive film, and (iii) a support substrate attached to the adhesive resin layer (B) of the adhesive film; a step (2) of sealing the electronic component with a sealing material; a step (3) of peeling the support substrate from the structure by reducing an adhesive force of the adhesive resin layer (B) by applying an external stimulus; and a step (4) of peeling the adhesive film from the electronic component.

公开(公告)号：US10662355B2

公开(公告)日：2020-05-26

申请号：US15752638

申请日：2016-07-12

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Manami Saito ,  Hiroyoshi Kurihara

IPC: C09J133/06 ,  C09J175/14 ,  C09J7/38 ,  C09J11/06 ,  C09J201/06 ,  C09J175/04 ,  C09J5/00 ,  C08K5/098 ,  C08K5/17

Abstract: The present invention is an adhesive composition that is characterized by including (A) a polymer comprising a structural unit having a hydroxy group in a side chain, (B) a compound having two or more isocyanate groups, (C) a bismuth carboxylate, and (D) a tertiary amine having a pKa of 6 or more. The polymer (A) may include further a structural unit having a urethane bond and a polymerizable unsaturated bond in a side chain.

公开(公告)号：US10515839B2

公开(公告)日：2019-12-24

申请号：US16319874

申请日：2017-07-20

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Hiroyoshi Kurihara

IPC: H01L21/68 ,  H01L21/683 ,  C09J9/02 ,  C09J133/08 ,  H01L23/00 ,  H01L21/306

Abstract: A method for manufacturing a semiconductor device includes at least the following three steps. A step (A) of preparing a structure including a semiconductor wafer having a circuit-formed surface and an adhesive film attached to the circuit-formed surface side of the semiconductor wafer. A step (B) of back grinding a surface on a side opposite to the circuit-formed surface side of the semiconductor wafer. A step (C) of radiating ultraviolet rays to the adhesive film and then removing the adhesive film from the semiconductor wafer. In addition, as the adhesive film, an adhesive film having a base material layer, an antistatic layer, and an adhesive resin layer including a conductive additive in this order is used, and the adhesive film is used so that the adhesive resin layer faces the circuit-formed surface side of the semiconductor wafer.

公开(公告)号：US11848215B2

公开(公告)日：2023-12-19

申请号：US17044129

申请日：2019-03-19

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Kouji Igarashi ,  Jin Kinoshita ,  Hiroyoshi Kurihara ,  Toru Miura

IPC: H01L21/56 ,  C09J7/38 ,  B32B37/06 ,  B32B37/12 ,  B32B37/18 ,  C09J5/00 ,  C09K3/10 ,  H01L21/683 ,  H01L21/78 ,  H01L23/00

CPC classification number: H01L21/568 ,  B32B37/06 ,  B32B37/12 ,  B32B37/182 ,  C09J5/00 ,  C09J7/385 ,  C09K3/10 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6835 ,  H01L21/78 ,  H01L24/96 ,  B32B2457/00 ,  C09J2203/326 ,  C09J2301/124 ,  C09J2301/502 ,  C09J2433/00 ,  C09K2200/0647 ,  H01L2221/68386 ,  H01L2224/95001

Abstract: The method for manufacturing an electronic device includes at least: a step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer and for temporarily fixing an electronic component, and an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is decreased by an external stimulus, an electronic component attached to the adhesive resin layer (A) of the adhesive film, and a support substrate attached to the adhesive resin layer (B) of the adhesive film; at least one step selected from a step of decreasing water content in the adhesive film and a step of decreasing water content in the structure; and a step of sealing the electronic component with a sealing material.

公开(公告)号：US11840652B2

公开(公告)日：2023-12-12

申请号：US17041470

申请日：2019-03-19

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Kouji Igarashi ,  Jin Kinoshita ,  Hiroyoshi Kurihara ,  Toru Miura

IPC: C09J7/38 ,  H01L21/56 ,  H01L21/683

CPC classification number: C09J7/385 ,  H01L21/568 ,  H01L21/6836 ,  C09J2203/326 ,  C09J2301/1242 ,  C09J2433/00 ,  C09J2467/006

Abstract: An adhesive film includes a base material layer; an adhesive resin layer (A) provided on a first surface side of the base material layer; and an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is decreased by an external stimulus, in which, as measured by method 1, an integrated tacking force value (F2.5) of the adhesive resin layer (B) is 1.0 gf/sec or more at a test speed of 2.5 mm/min and a test temperature of 130° C., and an integrated tacking force value (F30) of the adhesive resin layer (B) is 7.0 gf/sec or more at a test speed of 30 mm/min and a test temperature of 130° C.

公开(公告)号：US12106974B2

公开(公告)日：2024-10-01

申请号：US17438650

申请日：2020-02-27

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Toru Miura ,  Hiroyoshi Kurihara

IPC: H01L21/56 ,  B32B7/12 ,  B32B27/08 ,  B32B37/12 ,  C09J7/38

CPC classification number: H01L21/568 ,  B32B7/12 ,  B32B27/08 ,  B32B37/12 ,  C09J7/385 ,  B32B2307/732 ,  B32B2457/00 ,  C09J2203/326 ,  C09J2423/00 ,  C09J2425/00 ,  C09J2433/00 ,  C09J2475/00 ,  C09J2483/00

Abstract: A method for manufacturing an electronic device includes at least a preparing step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is reduced by external stimuli, and an unevenness-absorbing resin layer (C) provided between the base material layer and the adhesive resin layer (A) or between the base material layer and the adhesive resin layer (B), an electronic component attached to the adhesive resin layer (A) of the adhesive film and having an uneven structure, and a support substrate attached to the adhesive resin layer (B) of the adhesive film; and a sealing step of sealing the electronic component with a sealing material.

公开(公告)号：US11034864B2

公开(公告)日：2021-06-15

申请号：US16478614

申请日：2018-01-17

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Kouji Igarashi ,  Jin Kinoshita ,  Hiroyoshi Kurihara

IPC: H01L21/00 ,  C09J7/24 ,  C09J7/35 ,  C09J11/06 ,  C09J201/00 ,  H01L21/02 ,  H01L23/00

Abstract: An adhesive film used when sealing an electronic component to temporarily fix the electronic component, the adhesive film including a base material layer, an adhesive resin layer which is provided on a first surface side of the base material layer and which is for temporarily fixing the electronic component, and an adhesive resin layer which is provided on a second surface side of the base material layer and of which the adhesive strength decreases according to an external stimulus, in which the adhesive resin layer includes a polyvalent carboxylic acid ester-based plasticizer and an adhesive resin, and a content of the polyvalent carboxylic acid ester-based plasticizer in the adhesive resin layer is more than or equal to 0.7 parts by mass and less than or equal to 50 parts by mass with respect to 100 parts by mass of the adhesive resin included in the adhesive resin layer.

公开(公告)号：US10577438B2

公开(公告)日：2020-03-03

申请号：US15758013

申请日：2016-07-15

Applicant: Mitsui Chemicals Tohcello, Inc.

Inventor： Hiroyoshi Kurihara ,  Manami Saito

IPC: C08F8/30 ,  C08G18/81 ,  C08F220/18 ,  C08G18/62 ,  C08F299/00 ,  C09J175/16 ,  C08G18/22 ,  C09D175/16 ,  C08J3/24 ,  C09J133/06

Abstract: The present invention is a method for producing a polyfunctional polymer that contains a structural unit having a urethane bond and a polymerizable unsaturated bond in a side chain, and is characterised by including a reaction process in which a polymer (P) containing a structural unit (a) having a hydroxy group in a side chain and a monomer (M) having an isocyanate group and a polymerizable unsaturated bond are reacted in the presence of a bismuth carboxylate.