Invention Grant
- Patent Title: Package structure and method of fabricating the same
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Application No.: US15806338Application Date: 2017-11-08
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Publication No.: US10665473B2Publication Date: 2020-05-26
- Inventor: Chia-Hsiang Lin , Feng-Cheng Hsu , Shuo-Mao Chen , Shin-Puu Jeng , Arunima Banerjee
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/498 ; H01L23/00 ; H01L21/683 ; H01L25/10 ; H01L23/31 ; H01L25/065
Abstract:
A package structure including a semiconductor die, a redistribution layer and a plurality of conductive elements is provided. At least one joint of the joints in the redistribution layer or on the semiconductor die is connected with the conductive element for electrically connecting the redistribution layer, the semiconductor die and the conductive elements.
Public/Granted literature
- US20190139784A1 PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME Public/Granted day:2019-05-09
Information query
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