公开(公告)号：US11251142B2

公开(公告)日：2022-02-15

申请号：US16881013

申请日：2020-05-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chia-Hsiang Lin ,  Feng-Cheng Hsu ,  Shuo-Mao Chen ,  Shin-Puu Jeng ,  Arunima Banerjee

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/498 ,  H01L21/683 ,  H01L25/10 ,  H01L23/31 ,  H01L25/065

Abstract: A package structure including a semiconductor die, a redistribution layer and a plurality of conductive elements is provided. At least one joint of the joints in the redistribution layer or on the semiconductor die is connected with the conductive element for electrically connecting the redistribution layer, the semiconductor die and the conductive elements. The fabrication methods for forming a package structure are provided.

公开(公告)号：US20200286744A1

公开(公告)日：2020-09-10

申请号：US16881013

申请日：2020-05-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chia-Hsiang Lin ,  Feng-Cheng Hsu ,  Shuo-Mao Chen ,  Shin-Puu Jeng ,  Arunima Banerjee

IPC: H01L21/48 ,  H01L23/498 ,  H01L23/00 ,  H01L21/683

Abstract: A package structure including a semiconductor die, a redistribution layer and a plurality of conductive elements is provided. At least one joint of the joints in the redistribution layer or on the semiconductor die is connected with the conductive element for electrically connecting the redistribution layer, the semiconductor die and the conductive elements. The fabrication methods for forming a package structure are provided.

公开(公告)号：US10665473B2

公开(公告)日：2020-05-26

申请号：US15806338

申请日：2017-11-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chia-Hsiang Lin ,  Feng-Cheng Hsu ,  Shuo-Mao Chen ,  Shin-Puu Jeng ,  Arunima Banerjee

IPC: H01L21/48 ,  H01L23/498 ,  H01L23/00 ,  H01L21/683 ,  H01L25/10 ,  H01L23/31 ,  H01L25/065

Abstract: A package structure including a semiconductor die, a redistribution layer and a plurality of conductive elements is provided. At least one joint of the joints in the redistribution layer or on the semiconductor die is connected with the conductive element for electrically connecting the redistribution layer, the semiconductor die and the conductive elements.

公开(公告)号：US20190139784A1

公开(公告)日：2019-05-09

申请号：US15806338

申请日：2017-11-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chia-Hsiang Lin ,  Feng-Cheng Hsu ,  Shuo-Mao Chen ,  Shin-Puu Jeng ,  Arunima Banerjee

IPC: H01L21/48 ,  H01L23/498

Abstract: A package structure including a semiconductor die, a redistribution layer and a plurality of conductive elements is provided. At least one joint of the joints in the redistribution layer or on the semiconductor die is connected with the conductive element for electrically connecting the redistribution layer, the semiconductor die and the conductive elements.