Invention Grant
- Patent Title: Quantum dot and method for manufacturing the same
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Application No.: US15806995Application Date: 2017-11-08
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Publication No.: US10669477B2Publication Date: 2020-06-02
- Inventor: Yi-Chun Liu , Yu-Yang Su , Chun-Hsiang Wen
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: C09K11/70
- IPC: C09K11/70 ; B22F1/02 ; B22F1/00 ; B82Y20/00 ; B82Y40/00

Abstract:
A method for manufacturing a quantum dot and a quantum dot are provided. The method includes adding a core semiconductor precursor solution into a seed composition solution. The seed composition solution includes a seed composition, and the seed composition is a dendrimer-metal nanoparticle composite. The core semiconductor precursor solution includes a first semiconductor ion and a second semiconductor ion. The method also includes carrying out a first synthesis reaction to form a core semiconductor material wrapping the seed composition. The core semiconductor material is formed by combining the first semiconductor ion with the second semiconductor ion.
Public/Granted literature
- US20180127649A1 QUANTUM DOT AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2018-05-10
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