Invention Grant
- Patent Title: Electronic device package with recessed substrate for underfill containment
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Application No.: US16083611Application Date: 2016-04-01
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Publication No.: US10672625B2Publication Date: 2020-06-02
- Inventor: Sergio A. Chan Arguedas , Joshua D. Heppner , Jimin Yao
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Thorpe North and Western, LLP
- Agent David W. Osborne
- International Application: PCT/US2016/025629 WO 20160401
- International Announcement: WO2017/171850 WO 20171005
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/00 ; H01L23/31 ; H01L23/13 ; H01L23/15 ; H01L23/14
Abstract:
Electronic device package technology is disclosed. In one example, an electronic device package can include a substrate having a recess, an electronic component disposed in the recess and electrically coupled to the substrate, and an underfill material disposed in the recess between the electronic component and the substrate. Associated systems and methods are also disclosed.
Public/Granted literature
- US20190074199A1 ELECTRONIC DEVICE PACKAGE Public/Granted day:2019-03-07
Information query
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