Invention Grant
- Patent Title: Advanced BEOL interconnect architecture
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Application No.: US15807156Application Date: 2017-11-08
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Publication No.: US10672649B2Publication Date: 2020-06-02
- Inventor: Chih-Chao Yang , Theo Standaert
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Alvin Borromeo
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/532 ; H01L21/3213 ; C23C18/54 ; H01L21/321 ; H01L21/28 ; C23C18/16 ; C23C18/38 ; C25D7/12
Abstract:
Advanced dual damascene interconnects have been provided in which a metallic seed liner composed of an electrically conductive metal or metal alloy having a first bulk resistivity is located on sidewall surfaces and a bottom wall of a first metallic structure that is present in a via portion of a combined via/line opening that is present in an interconnect dielectric material layer. The first metallic structure is composed of an electrically conductive metal or metal alloy that has a second bulk resistivity that is higher than the first bulk resistivity. In some embodiments, a second metal structure is present on a topmost surface of the first metallic structure. The second metallic structure is composed of an electrically conductive metal or metal alloy that differs from the electrically conductive metal or metal alloy of the first metallic structure.
Public/Granted literature
- US20190139820A1 ADVANCED BEOL INTERCONNECT ARCHITECTURE Public/Granted day:2019-05-09
Information query
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