Invention Grant
- Patent Title: Method and apparatus for inspecting defects on transparent substrate
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Application No.: US16346704Application Date: 2017-10-31
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Publication No.: US10677739B2Publication Date: 2020-06-09
- Inventor: Uta-Barbara Goers , En Hong , Sung-chan Hwang , Ji Hwa Jung , Tae-ho Keem , Philip Robert LeBlanc , Rajeshkannan Palanisamy , Sung-jong Pyo , Correy Robert Ustanik
- Applicant: Corning Incorporated
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- International Application: PCT/US2017/059213 WO 20171031
- International Announcement: WO2018/085233 WO 20180511
- Main IPC: G01N21/896
- IPC: G01N21/896 ; G02B7/182 ; G02B21/18 ; G02B21/10

Abstract:
A method of inspecting defects of a transparent substrate may include: illuminating a transparent substrate; calculating an incidence angle range of light so that a first region where the light meets a first surface of the transparent substrate and a second region where light meets a second surface being opposite the first surface of the transparent substrate do not overlap each other; adjusting an incidence angle according to the incidence angle range; adjusting a position of a first detector so that a first field-of-view of the first detector covers the first region and does not cover the second region; adjusting a position of a second detector so that a second field-of-view of the second detector covers the second region and does not cover the first region; and obtaining a first image of the first region and a second image of the second region from the first and second detector, respectively.
Public/Granted literature
- US20190257765A1 METHOD AND APPARATUS FOR INSPECTING DEFECTS ON TRANSPARENT SUBSTRATE Public/Granted day:2019-08-22
Information query
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