Invention Grant
- Patent Title: Substrate processing apparatus having cooling member
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Application No.: US15443306Application Date: 2017-02-27
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Publication No.: US10679845B2Publication Date: 2020-06-09
- Inventor: Hiroaki Inadomi , Satoshi Okamura , Satoshi Biwa
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2cde989d
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/02 ; B08B7/00 ; H01L21/677 ; B08B3/08 ; H01L21/687

Abstract:
Disclosed is a substrate processing apparatus. The substrate processing apparatus includes a container body, and a holding member that conveys the substrate from an outside of the container body into the container body and holds the substrate inside the container body during the processing. A substrate support pin supporting a wafer and a cooling plate cooling the holding member are provided outside the container body.
Public/Granted literature
- US20170256398A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM Public/Granted day:2017-09-07
Information query
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