Invention Grant
- Patent Title: Package structure and manufacturing method thereof
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Application No.: US16172836Application Date: 2018-10-28
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Publication No.: US10679915B2Publication Date: 2020-06-09
- Inventor: Ping-Yin Hsieh , Chin-Fu Kao , Li-Hui Cheng , Szu-Wei Lu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/31 ; H01L25/18 ; H01L21/56 ; H01L23/532 ; H01L23/00 ; H01L21/82
Abstract:
A package structure includes a plurality of first dies, a first encapsulant, and a first redistribution structure. The first encapsulant encapsulates the first dies. The first redistribution structure is disposed on the first dies and the first encapsulant. The first redistribution structure includes a dielectric layer covering a top surface and sidewalls of the first encapsulant.
Public/Granted literature
- US20200135601A1 PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2020-04-30
Information query
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