公开(公告)号：US20230378020A1

公开(公告)日：2023-11-23

申请号：US18446014

申请日：2023-08-08

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Ping-Yin Hsieh ,  Pu Wang ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC分类号： H01L23/367 ,  H01L23/498 ,  H01L23/373 ,  H01L23/00 ,  H01L21/48 ,  H01L25/00 ,  H01L25/10

CPC分类号： H01L23/3675 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/373 ,  H01L24/73 ,  H01L21/4882 ,  H01L25/50 ,  H01L24/16 ,  H01L24/32 ,  H01L25/105 ,  H01L2224/73204 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/182 ,  H01L2924/35121 ,  H01L2924/3511 ,  H01L2224/16237 ,  H01L2224/32225

摘要： A method includes placing a package, which includes a first package component, a second package component, and an encapsulant encapsulating the first package component and the second package component therein. The method further includes attaching a first thermal interface material over the first package component, attaching a second thermal interface material different from the first thermal interface material over the second package component, and attaching a heat sink over both of the first thermal interface material and the second thermal interface material.

公开(公告)号：US11527418B2

公开(公告)日：2022-12-13

申请号：US17026712

申请日：2020-09-21

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Jing-Cheng Lin ,  Li-Hui Cheng ,  Po-Hao Tsai

IPC分类号： H01L21/56 ,  H01L21/78 ,  H01L23/31 ,  H01L21/683 ,  H01L23/00 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L21/66

摘要： An integrated circuit package and a method of forming the same are provided. A method includes forming a conductive column over a carrier. An integrated circuit die is attached to the carrier, the integrated circuit die being disposed adjacent the conductive column. An encapsulant is formed around the conductive column and the integrated circuit die. The carrier is removed to expose a first surface of the conductive column and a second surface of the encapsulant. A polymer material is formed over the first surface and the second surface. The polymer material is cured to form an annular-shaped structure. An inner edge of the annular-shaped structure overlaps the first surface in a plan view. An outer edge of the annular-shaped structure overlaps the second surface in the plan view.

公开(公告)号：US20220384355A1

公开(公告)日：2022-12-01

申请号：US17818797

申请日：2022-08-10

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chih-Hao Chen ,  Pu Wang ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC分类号： H01L23/538 ,  H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00 ,  H01L25/065

摘要： Semiconductor devices and methods of manufacture are provided, in which an adhesive is removed from a semiconductor die embedded within an encapsulant, and an interface material is utilized to remove heat from the semiconductor device. The removal of the adhesive leaves behind a recess adjacent to a sidewall of the semiconductor, and the recess is filled.

公开(公告)号：US11302683B2

公开(公告)日：2022-04-12

申请号：US16836927

申请日：2020-04-01

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chih-Chien Pan ,  Chin-Fu Kao ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC分类号： H01L25/16 ,  H01L23/00 ,  H01L21/56 ,  G02B6/13 ,  H01L23/24

摘要： A package structure and method of forming the same are provided. The package structure includes a first die, a second die, a wall structure and an encapsulant. The second die is electrically bonded to the first die. The wall structure is laterally aside the second die and on the first die. The wall structure is in contact with the first die and a hole is defined within the wall structure for accommodating an optical element insertion. The encapsulant laterally encapsulates the second die and the wall structure.

公开(公告)号：US11296051B2

公开(公告)日：2022-04-05

申请号：US16547609

申请日：2019-08-22

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chin-Fu Kao ,  Chih-Yuan Chien ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC分类号： H01L25/065 ,  H01L23/367 ,  H01L23/31 ,  H01L23/538 ,  H01L21/48 ,  H01L23/00 ,  H01L21/56

摘要： Semiconductor packages and methods of forming the same are provided. One of the semiconductor packages includes a first semiconductor die, an adhesive layer, a second semiconductor die and an underfill. The first semiconductor die includes a first surface, and the first surface includes a central region and a peripheral region surrounding the central region. The adhesive layer is adhered to the peripheral region and exposes the central region. The second semiconductor die is stacked over the first surface of the first semiconductor die. The underfill is disposed between the first semiconductor die and the second semiconductor die.

公开(公告)号：US11239134B2

公开(公告)日：2022-02-01

申请号：US16745338

申请日：2020-01-17

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chih-Hao Chen ,  Chin-Fu Kao ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC分类号： H01L23/367 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H01L21/683 ,  H01L21/56

摘要： A structure includes a circuit substrate, a device, a metal layer, a lid and a thermal interface material layer. The device is disposed on and electrically connected to the circuit substrate. The device includes at least one semiconductor die laterally encapsulated by an insulating encapsulation. The metal layer is covering a back surface of the at least one semiconductor die and the insulating encapsulation. The lid is disposed on the circuit substrate, and the lid is adhered to the metal layer through the thermal interface material layer.

公开(公告)号：US20210118758A1

公开(公告)日：2021-04-22

申请号：US16655135

申请日：2019-10-16

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Li-Hui Cheng ,  Chin-Fu Kao ,  Szu-Wei Lu ,  Chih-Chien Pan

IPC分类号： H01L23/31 ,  H01L23/00 ,  H01L21/56

摘要： Semiconductor packages and methods of forming the same are disclosed. a semiconductor package includes a die and an underfill. The die is disposed over a surface and includes a first sidewall. The underfill encapsulates the die. The underfill includes a first underfill fillet on the first sidewall, and in a cross-sectional view, a second sidewall of the first underfill fillet has a turning point.

公开(公告)号：US20210057384A1

公开(公告)日：2021-02-25

申请号：US16547609

申请日：2019-08-22

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chin-Fu Kao ,  Chih-Yuan Chien ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC分类号： H01L25/065 ,  H01L23/367 ,  H01L23/31 ,  H01L23/538 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00

摘要： Semiconductor packages and methods of forming the same are provided. One of the semiconductor packages includes a first semiconductor die, an adhesive layer, a second semiconductor die and an underfill. The first semiconductor die includes a first surface, and the first surface includes a central region and a peripheral region surrounding the central region. The adhesive layer is adhered to the peripheral region and exposes the central region. The second semiconductor die is stacked over the first surface of the first semiconductor die. The underfill is disposed between the first semiconductor die and the second semiconductor die.

公开(公告)号：US20200273718A1

公开(公告)日：2020-08-27

申请号：US16283851

申请日：2019-02-25

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Li-Hui Cheng ,  Szu-Wei Lu ,  Ping-Yin Hsieh ,  Chih-Hao Chen

IPC分类号： H01L21/48 ,  H01L23/00 ,  H01L25/10 ,  H01L21/56

摘要： A package structure and the manufacturing method thereof are provided. The package structure includes a semiconductor die, conductive through vias, an insulating encapsulant, and a redistribution structure. The conductive through vias are electrically coupled to the semiconductor die. The insulating encapsulant laterally encapsulates the semiconductor die and the conductive through vias, wherein the insulating encapsulant has a recess ring surrounding the semiconductor die, the conductive through vias are located under the recess ring, and a vertical projection of each of the conductive through vias overlaps with a vertical projection of the recess ring. The redistribution structure is electrically connected to the semiconductor die and the conductive through vias.

公开(公告)号：US10438934B1

公开(公告)日：2019-10-08

申请号：US15979494

申请日：2018-05-15

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Shih-Ting Lin ,  Chin-Fu Kao ,  Jing-Cheng Lin ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L25/10 ,  H01L25/00 ,  H01L23/538 ,  H01L21/56 ,  H01L21/48

摘要： A package-on-package structure including a first and second package is provided. The first package includes a semiconductor die, through insulator vias, an insulating encapsulant, conductive terminals and a redistribution layer. The semiconductor die has a die height H1. The plurality of through insulator vias is surrounding the semiconductor die and has a height H2, and H2